A fast thermal embossing process of polymer micro-nano structure differential temperature flat plate

A technology of micro-nano structure and flat plate hot pressing, which is applied in the field of polymer micro-nano structure differential temperature flat hot embossing process, which can solve the problems of serious time-consuming, demolding defects, prolonging the flat hot embossing process cycle, etc. The effects of small mold defects, low imprinting temperature, and shortened plate hot embossing cycle
CN106808677BActive Publication Date: 2019-04-26BEIJING UNIV OF CHEM TECH

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
BEIJING UNIV OF CHEM TECH
Publication Date
2019-04-26

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Abstract

The invention discloses a rapid differential-temperature flat plate hot embossing process for a polymer micro-nano structure. The rapid differential-temperature flat plate hot embossing process is characterized in that temperature of a hot embossing mold is kept consistent in the whole embossing period, set temperatures of an upper half mold and a lower half mold are different, the aims of smooth mold filling and mold release of the micro-nano structure are achieved through the differential-temperature mode, and the rapid differential-temperature flat plate hot embossing process is particularly suitable for rapid hot embossing of a polymer product with the single-face micro-nano structure. The temperature of the side, provided with the micro-nano structure, of the mold is set as a higher value, and the side, not provided with the micro-nano structure, of the mold is set as a lower value. At the initial stage of hot embossing, the temperature of a polymer substrate making contact with the high-temperature half mold rapidly rises to a high temperature, and mold filing is completed; and at the pressure maintaining stage, the polymer substrate is cooled through the low-temperature half mold, the formed micro-nano structure is shaped, and demolding is facilitated. By means of the process, it is avoided that because the mold is repeatedly heated and cooled, energy is consumed, and meanwhile the forming period of hot embossing is remarkably shortened; controllability of the forming process is high, the forming precision is high, and the overall consistency is good; and the mold sticking phenomenon of the polymer product is obviously improved, and demolding defects are effectively avoided.
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Description

technical field

[0001] The invention relates to a process method of flat hot embossing, which is a polymer micro-nano structure differential temperature flat hot embossing process for rapid prototyping by utilizing elastic-plastic deformation in a solid state of polymers. Background technique

[0002] Polymer devices with micro-nano structures have important applications in precision optics, biomedicine and other fields. Flat plate thermal embossing technology is one of the main process methods for preparing polymer micro-nano structure devices, which has the characteristics of high micro-nano structure replication rate and high molding precision.

[0003] Flat hot embossing generally adopts the isothermal hot embossing process, that is, the temperature of the mold and the polymer is kept the same, and the hot embossing process is completed through four steps of heating, embossing, cooling, and demoulding. During the hot pressing process, the mold needs to undergo repeated ...

Claims

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