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A fast thermal embossing process of polymer micro-nano structure differential temperature flat plate

A technology of micro-nano structure and flat plate hot pressing, which is applied in the field of polymer micro-nano structure differential temperature flat hot embossing process, which can solve the problems of serious time-consuming, demolding defects, prolonging the flat hot embossing process cycle, etc. The effects of small mold defects, low imprinting temperature, and shortened plate hot embossing cycle

Active Publication Date: 2019-04-26
BEIJING UNIV OF CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the hot pressing process, the mold needs to undergo repeated heating and cooling, which takes a lot of time and prolongs the process cycle of flat hot embossing; in addition, insufficient cooling of the mold can easily lead to the occurrence of mold release defects

Method used

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  • A fast thermal embossing process of polymer micro-nano structure differential temperature flat plate
  • A fast thermal embossing process of polymer micro-nano structure differential temperature flat plate
  • A fast thermal embossing process of polymer micro-nano structure differential temperature flat plate

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Experimental program
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Effect test

Embodiment 1

[0033] The present embodiment provides with 1mm thickness PMMA (T g =105°C) thin plate is the micro-nano structure thermal embossing method of substrate, the surface of the micro-nano structure mold used is a V-Cut structure with a characteristic size of 25 μm, comprising the following steps:

[0034] (1) Preheating: The PMMA substrate is preheated to 110°C, and the preheating process ensures that the temperature distribution of the polymer pressure surface is even;

[0035] (2) Embossing: The mold temperature on the side with V-Cut structure is set to 120°C, and the mold temperature on the side without structure is set to 100°C to ensure uniform temperature distribution on the mold surface. The material is embossed, the embossing pressure is set to 4Mpa, and the embossing time is set to 30s;

[0036] (3) Demoulding: After the thermal embossing micro-nano structure is filled, the mold temperature remains unchanged, and the mold is directly demoulded to obtain a polymer device...

Embodiment 2

[0038] The present embodiment provides with 0.25mm thickness PC (T g =150°C) sheet is the micro-nano structure heat embossing method of base material, and the surface of the micro-nano structure mold used is a hemispherical structure with a diameter of 40 μm, comprising the following steps:

[0039] (1) Embossing: The temperature of the mold on the side with the hemispherical structure is set to 160°C, and the temperature of the mold on the side without the structure is set to 140°C to ensure uniform temperature distribution on the surface of the mold, and the mold directly performs thermal embossing on the PC substrate at room temperature , the embossing pressure is set to 8Mpa, and the embossing time is set to 60s;

[0040] (2) Demoulding: After the hot embossing is completed, the mold temperature is kept constant, and the mold is directly demoulded to obtain a polymer device with a hemispherical microstructure on the surface.

Embodiment 3

[0042] The present embodiment provides with 1mm thickness PMMA (T g =105 DEG C) thin plate is the micro-nano structure thermal embossing method of base material, and the micro-nano structure mold surface used is the nano cylinder structure that characteristic size is 200nm, comprises the following steps:

[0043] (1) Preheating: The PMMA substrate is preheated to 110°C, and the preheating process ensures that the temperature distribution of the polymer pressure surface is even;

[0044](2) Embossing: The temperature of the mold on the side with the nano-cylindrical structure is set to 125°C, and the mold temperature on the side without the structure is set to 95°C to ensure that the surface temperature of the mold is evenly distributed, and the mold is directly hot-pressed on the PMMA substrate at room temperature Printing, the printing pressure is set to 10Mpa, and the printing time is set to 90s;

[0045] (3) Demoulding: After the thermal embossing micro-nano structure is f...

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Abstract

The invention discloses a rapid differential-temperature flat plate hot embossing process for a polymer micro-nano structure. The rapid differential-temperature flat plate hot embossing process is characterized in that temperature of a hot embossing mold is kept consistent in the whole embossing period, set temperatures of an upper half mold and a lower half mold are different, the aims of smooth mold filling and mold release of the micro-nano structure are achieved through the differential-temperature mode, and the rapid differential-temperature flat plate hot embossing process is particularly suitable for rapid hot embossing of a polymer product with the single-face micro-nano structure. The temperature of the side, provided with the micro-nano structure, of the mold is set as a higher value, and the side, not provided with the micro-nano structure, of the mold is set as a lower value. At the initial stage of hot embossing, the temperature of a polymer substrate making contact with the high-temperature half mold rapidly rises to a high temperature, and mold filing is completed; and at the pressure maintaining stage, the polymer substrate is cooled through the low-temperature half mold, the formed micro-nano structure is shaped, and demolding is facilitated. By means of the process, it is avoided that because the mold is repeatedly heated and cooled, energy is consumed, and meanwhile the forming period of hot embossing is remarkably shortened; controllability of the forming process is high, the forming precision is high, and the overall consistency is good; and the mold sticking phenomenon of the polymer product is obviously improved, and demolding defects are effectively avoided.

Description

technical field [0001] The invention relates to a process method of flat hot embossing, which is a polymer micro-nano structure differential temperature flat hot embossing process for rapid prototyping by utilizing elastic-plastic deformation in a solid state of polymers. Background technique [0002] Polymer devices with micro-nano structures have important applications in precision optics, biomedicine and other fields. Flat plate thermal embossing technology is one of the main process methods for preparing polymer micro-nano structure devices, which has the characteristics of high micro-nano structure replication rate and high molding precision. [0003] Flat hot embossing generally adopts the isothermal hot embossing process, that is, the temperature of the mold and the polymer is kept the same, and the hot embossing process is completed through four steps of heating, embossing, cooling, and demoulding. During the hot pressing process, the mold needs to undergo repeated ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C59/02
CPCB29C59/002B29C59/022B29C2059/023
Inventor 吴大鸣孙靖尧刘颖郑秀婷许红赵中里
Owner BEIJING UNIV OF CHEM TECH
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