A Fast Isothermal Flat Plate Hot Embossing Process for Polymer Microstructures
An isothermal plate and polymer technology, applied in the direction of microstructure technology, microstructure devices, manufacturing microstructure devices, etc., can solve the problems of prolonging the plate hot embossing cycle, serious time-consuming, easy demoulding, etc., to shorten the plate Hot embossing cycle, easy operation and high molding precision
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Embodiment 1
[0029] A fast polymer microstructure isothermal flat plate hot embossing process, the polymer substrate is amorphous, specifically carried out through the following steps.
[0030] (1) Preheating, preheating the polymer substrate, specifically preheating the polymer substrate to a temperature 5°C to 20°C above its glass transition temperature Tg, and then performing hot embossing. The preheating operation ensures that the polymerization The temperature distribution of the pressed surface of the object substrate is uniform.
[0031] (2) hot embossing, the mold of the microstructure is under the condition that the temperature is 5°C to 20°C below the glass transition temperature Tg of the amorphous polymer to be hot embossed, and the polymer substrate is hot embossed. The printing pressure is 2~10Mpa, and the time is 5s~30s. figure 1 It is the temperature and pressure control process curve suitable for the amorphous polymer microstructure isothermal plate hot embossing process ...
Embodiment 2
[0039] A fast polymer microstructure isothermal plate hot embossing process, the polymer substrate is crystallized, specifically carried out through the following steps.
[0040] Under the condition that the temperature is 10°C-50°C below the crystalline melting point Tm of the crystalline polymer to be hot-embossed, the microstructure mold directly heats the crystalline polymer substrate at room temperature to below the crystalline melting point, After the hot embossing is completed, the mold is directly demolded while keeping the mold temperature constant, and a polymer device with a microstructure on the surface is obtained. The pressure of hot embossing is 2~10Mpa, and the time is 5s~30s. figure 2 It is the temperature and pressure control process curve suitable for the crystalline polymer microstructure isothermal plate hot embossing process of the present invention.
[0041]It should be noted that the crystalline polymer includes but not limited to PP, PE or PET, and t...
Embodiment 3
[0046] This embodiment provides a rapid polymer microstructure isothermal plate hot embossing process using PMMA (Polymethylmethacrylate) as the substrate, and the glass transition temperature Tg of the amorphous polymer PMMA substrate is 105°C. The mold surface of the microstructure used is a V-Cut structure with a characteristic size of 50 μm.
[0047] The rapid polymer microstructure isothermal flat plate hot embossing process includes the following steps:
[0048] (1) Preheating: the PMMA substrate is preheated to 110°C, and the temperature of the pressure-bearing surface of the polymer substrate is controlled to be uniformly distributed during the preheating process;
[0049] (2) Embossing: Keep the mold temperature of the microstructure at 100°C to ensure uniform temperature distribution on the surface of the flat mold. The flat mold performs hot embossing on the preheated polymer substrate. The time is 15s;
[0050] (3) Demoulding: After the hot embossing is completed...
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