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A Fast Isothermal Flat Plate Hot Embossing Process for Polymer Microstructures

An isothermal plate and polymer technology, applied in the direction of microstructure technology, microstructure devices, manufacturing microstructure devices, etc., can solve the problems of prolonging the plate hot embossing cycle, serious time-consuming, easy demoulding, etc., to shorten the plate Hot embossing cycle, easy operation and high molding precision

Active Publication Date: 2018-06-26
BEIJING UNIV OF CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the preparation process, the mold needs to be heated and cooled repeatedly, which leads to serious time-consuming and prolongs the cycle of flat hot embossing; in addition, due to insufficient cooling during demoulding, demoulding is prone to demoulding defects
These shortcomings are the unresolved technical problems of flat hot embossing technology

Method used

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  • A Fast Isothermal Flat Plate Hot Embossing Process for Polymer Microstructures
  • A Fast Isothermal Flat Plate Hot Embossing Process for Polymer Microstructures

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] A fast polymer microstructure isothermal flat plate hot embossing process, the polymer substrate is amorphous, specifically carried out through the following steps.

[0030] (1) Preheating, preheating the polymer substrate, specifically preheating the polymer substrate to a temperature 5°C to 20°C above its glass transition temperature Tg, and then performing hot embossing. The preheating operation ensures that the polymerization The temperature distribution of the pressed surface of the object substrate is uniform.

[0031] (2) hot embossing, the mold of the microstructure is under the condition that the temperature is 5°C to 20°C below the glass transition temperature Tg of the amorphous polymer to be hot embossed, and the polymer substrate is hot embossed. The printing pressure is 2~10Mpa, and the time is 5s~30s. figure 1 It is the temperature and pressure control process curve suitable for the amorphous polymer microstructure isothermal plate hot embossing process ...

Embodiment 2

[0039] A fast polymer microstructure isothermal plate hot embossing process, the polymer substrate is crystallized, specifically carried out through the following steps.

[0040] Under the condition that the temperature is 10°C-50°C below the crystalline melting point Tm of the crystalline polymer to be hot-embossed, the microstructure mold directly heats the crystalline polymer substrate at room temperature to below the crystalline melting point, After the hot embossing is completed, the mold is directly demolded while keeping the mold temperature constant, and a polymer device with a microstructure on the surface is obtained. The pressure of hot embossing is 2~10Mpa, and the time is 5s~30s. figure 2 It is the temperature and pressure control process curve suitable for the crystalline polymer microstructure isothermal plate hot embossing process of the present invention.

[0041]It should be noted that the crystalline polymer includes but not limited to PP, PE or PET, and t...

Embodiment 3

[0046] This embodiment provides a rapid polymer microstructure isothermal plate hot embossing process using PMMA (Polymethylmethacrylate) as the substrate, and the glass transition temperature Tg of the amorphous polymer PMMA substrate is 105°C. The mold surface of the microstructure used is a V-Cut structure with a characteristic size of 50 μm.

[0047] The rapid polymer microstructure isothermal flat plate hot embossing process includes the following steps:

[0048] (1) Preheating: the PMMA substrate is preheated to 110°C, and the temperature of the pressure-bearing surface of the polymer substrate is controlled to be uniformly distributed during the preheating process;

[0049] (2) Embossing: Keep the mold temperature of the microstructure at 100°C to ensure uniform temperature distribution on the surface of the flat mold. The flat mold performs hot embossing on the preheated polymer substrate. The time is 15s;

[0050] (3) Demoulding: After the hot embossing is completed...

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Abstract

Provided is a fast constant-temperature flat hot-embossing process for forming a polymer microstructure. A microstructure mold is used to perform hot-embossing on a polymer substrate at a temperature 5°C-20°C below a glass transition temperature (Tg) of an amorphous polymer to be hot-embossed, or at a temperature 10°C-50°C below a crystalline melting point (Tm) of a crystalline polymer to be hot-embossed. After the hot-embossing has been completed, the mold is directly released when the temperature thereof remains unchanged, thereby obtaining a polymer device having a surface microstructure. The process employs plastic deformation at a temperature near a glass transition temperature (Tg) or a temperature below a crystalline melting point (Tm) of a polymer in a solid state to perform microstructure formation. The mold maintains a constant temperature during the hot-embossing process so that a time consuming problem caused by repeated heating and cooling processes can be prevented, thereby realizing a fast flat hot-embossing process for forming a microstructure. Moreover, the plastic deformation is performed at a strain yield stage by controlling temperatures, thereby preventing the plastic deformation from being performed at a strain hardening stage, and ensuring a higher reproduction rate of the microstructure.

Description

technical field [0001] The invention relates to a process method of flat plate hot embossing, in particular to a rapid polymer microstructure isothermal flat plate hot embossing process formed by plastic deformation in a solid state of polymer, and belongs to the technical field of micro-nano manufacturing. Background technique [0002] Polymer devices with micro-nano structures have important applications in the fields of precision optics and biomedicine. In recent years, the research on polymer micro-nano-structure devices has developed rapidly, and polymer micro-structures have considerable potential in the field of microtechnology. market. [0003] Hot embossing technology is one of the main process methods for preparing polymer micro-nano structure devices, which has the characteristics of high micro-nano structure replication rate and high molding precision. In 1995, Chou S.Y. of Princeton University in the United States first proposed a method of embossing solid poly...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C59/02B81C1/00
CPCB29C59/02B81C1/00
Inventor 吴大鸣刘颖郑秀婷杨振洲许红赵中里孙靖尧敬鹏生
Owner BEIJING UNIV OF CHEM TECH
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