Method for manufacturing a micro-technical component (100) with a substrate (3) as a
semiconductor substrate, which has a front (2) and a back (1) and with at least one electrical via (150, 150') in the substrate (3), the method comprising the following steps ... - Producing a protective layer (4) over a component structure (5) that is produced on and / or in a front face (2) of the substrate (3); - Forming at least one deep or long, hollow cylindrical
contact hole (14,14') to form the at least one via (150), wherein the
aspect ratio of the at least one via is greater than or equal to eight and extends from a surface of the back side (1) of the substrate to a contact surface (5a) of the component structure (5); - Forming a
metal-containing and therefore conductive lining (8,9,10) in the or each deep or long
contact hole (14,14'), so that a hollow,
electrically conductive structure (110) is formed in the or each
contact hole (14,14'); - Application of a
passivation layer (11) over the back of the substrate (3), which spans the hollow conductive structure to form at least one electrical via (150,150'); wherein the
passivation layer (11) is provided with openings or a local structuring takes place, adapted or suitable for subsequent
coating with further
metal layers (12) and for the placement of solder balls (13) over the back (1) of the substrate (3); and with the fabrication of a wiring structure (10a, 10b) on the surface of the back side for connecting the via (150) to a
solder ball structure (13), wherein the connection is a conductor track (10a) exhibits; wherein the spanning of the hollow conductive structure by the
passivation layer (11) is carried out and the process parameters during manufacturing are set in such a way that the vias (150) are covered without or without significant material input into the contact holes (14), thereby spanning them, in particular the hollow conductive structures (110).