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A kind of preparation technology of multilayer film

A preparation process and multi-layer film technology, applied in the field of flexible materials, can solve problems such as low production efficiency, increased probability of impurity intrusion, and reduced yield of finished products, so as to achieve the effect of improving yield rate, improving production efficiency, and avoiding impurity intrusion

Inactive Publication Date: 2019-11-19
GUANGDONG ZHENGYE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the pre-curing treatment after each pressing in the existing production process, the production efficiency of the multi-layer polyimide film is low, and the multiple curing will greatly increase the probability of impurity invasion, resulting in a decrease in the yield of the finished product. reduce

Method used

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  • A kind of preparation technology of multilayer film
  • A kind of preparation technology of multilayer film
  • A kind of preparation technology of multilayer film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Production of three-layer laminated polyimide with a total thickness of 200 μm, the raw material is 50 μm polyimide (PI) film of SKC Kolon’s GF 200 series (tensile strength ≥ 200 MPa, vertical and horizontal expansion and contraction ≤ 0.05%); water-based acrylic adhesive Adhesive (ANV series water-based acrylic glue produced by Guangdong Zhengye Technology Co., Ltd., with a solid content of 40wt%.

[0043] Step 1: Place a roll of 50μm PI film on the 1# sending device and 2# sending device respectively, the PI film of the 1# sending device passes through the slit coating head, coats the water-based acrylic adhesive, and then passes through the horizontal hot air Oven-dried to obtain a PI film with a thickness of 25 μm. Afterwards, the PI film with glue is laminated with the 50 μm PI film sent by the 2# sending device in the heating and pressing device, and is wound up at the winding device to obtain a 2-layer laminated PI film with a total thickness of 125 μm.

[0044]...

Embodiment 2

[0052] Production of three-layer laminated polyimide with a total thickness of 200 μm, the raw material is UPILEX-S series 50 μm polyimide (PI) film (tensile strength ≥ 200 MPa, vertical and horizontal expansion and contraction ≤ 0.05%) of Ube Corporation of Japan; water-based acrylic adhesive Adhesive (ANV series water-based acrylic glue produced by Guangdong Zhengye Technology Co., Ltd.).

[0053] Step 1: Place a roll of 50μm PI film on the 1# sending device and 2# sending device respectively, the PI film of the 1# sending device passes through the slit coating head, coats the water-based acrylic adhesive, and then passes through the horizontal hot air Oven-dried to obtain a PI film with a thickness of 25 μm. Afterwards, the PI film with glue is laminated with the 50 μm PI film sent by the 2# sending device in the heating and pressing device, and is wound up at the winding device to obtain a 2-layer laminated PI film with a total thickness of 125 μm.

[0054] Step 2: Place ...

Embodiment 3

[0062] Production of three-layer laminated polyimide with a total thickness of 250 μm, the raw material is 50 μm and 75 μm polyimide (PI) film of UPILEX-S series of Japan Ube Company; water-based acrylic adhesive (ANV series water-based adhesive produced by Guangdong Zhengye Technology Co., Ltd. acrylic glue).

[0063] Step 1: Place a roll of 75 μm PI film on the 1# sending device, place a roll of 50 μm PI film on the 2# sending device, the PI film of the 1# sending device passes through the slit coating head, and coat the water-based acrylic adhesive , and then dried in a horizontal hot air oven to obtain a PI film with an adhesive thickness of 25 μm. Afterwards, the PI film with glue is laminated with the 50 μm PI film sent by the 2# sending device in the heating and pressing device, and is wound up at the winding device to obtain a 2-layer laminated PI film with a total thickness of 150 μm.

[0064] Step 2: Place the 2-layer laminated PI film obtained in Step 1 on the 2# s...

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Abstract

The invention belongs to the field of flexible materials, in particular to a preparation technique for a multi-layer film. The preparation technique comprises the following steps that (a) a film is coated with adhesive liquid through a coating machine, solvents in the adhesive liquid are removed through a hot-air oven, then the film is pulled and conveyed to a heating and rolling device, another film is pulled to the heating and rolling device at the same time, and winding is conducted through a winding device after the two films overlap, so that a two-layer film is obtained; (b) the two-layer film obtained in the step (a) is coated with adhesive liquid through the coating machine, solvents in the adhesive liquid are removed through the hot-air oven, then the two-layer film is pulled and conveyed to the heating and rolling device, a polyimide film is pulled to the heating and rolling device at the same time, and winding is conducted through the winding device after the two films overlap, so that a three-layer film is obtained; (c) the film obtained through winding in the step (b) overlaps with other films repeatedly in the overlapping way in the step (b), so that an overlapped multi-layer film is obtained, wherein the number of repeated overlapping times is equal to or greater than zero; and (d) post curing is conducted on the overlapped multi-layer film obtained in the step (c).

Description

technical field [0001] The invention belongs to the field of flexible materials, and in particular relates to a preparation process of a multilayer film. Background technique [0002] At present, with the requirement of thin, light and small electronic products, more and more electronic products begin to use flexible printed circuit boards (FPC) as connecting wires of various electronic components. When used as a connection, FPC inevitably needs to be designed with gold fingers for plugging and pads for soldering electronic components. However, because the FPC itself is thin and soft, it is necessary to mount a certain strength on the back of these areas. The sheets are reinforced to facilitate plugging and welding. These sheets generally include polyimide, stainless steel sheets, glass fiber reinforced epoxy resin sheets, etc. with a thickness of 75-300 μm. The polyimide film with a thickness of 75-300 μm is widely used because of its good hardness, good solder resistance...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C65/48B32B27/08B32B27/28B29L7/00B29L9/00
CPCB29C65/4835B29C66/034B29C66/45B29C66/723B29L2007/00B29L2009/00B32B27/08B32B27/281B32B2250/24B32B2307/306B32B2457/08
Inventor 李磊徐地明苏华弟徐地华
Owner GUANGDONG ZHENGYE TECH
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