Mold

Abstract

The embodiment of the invention provides a mold and relates to the technical field of display. The mold can be used for forming a part to be formed, which is not easy to deform at a room temperature, and the resilience amount is small. The mold comprises an upper mold and a lower mold, which are arranged oppositely; after the molds are assembled, a surface, facing the lower mold, of the upper mold is in contact with a surface, facing the upper mold, of the lower mold; a heating part is arranged on the upper mold and/or the lower mold and is used for heating the part to be formed and forming the part to be formed.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a mold. Background technique [0002] With the rapid development of liquid crystal display technology, liquid crystal display devices (Liquid Crystal Display, referred to as LCD) are more and more widely used due to their advantages such as low power consumption, miniaturization, and thinness, especially for large-size LCD displays. The need is growing. However, the weight of the backlight module of a display screen with a large size, especially a display screen larger than 55 inches, also becomes heavier as the size becomes larger. The traditional backplane forming process uses molds such as figure 1 As shown, the mold 10 includes an upper mold 11 and a lower mold 12 , and a back plate 20 is disposed between the upper mold 11 and the lower mold 12 . The material of the traditional large-size backplane 20 is mostly stainless steel SU304 material, which has good strength but h...

AI Technical Summary

Problems solved by technology

If the 304 stainless steel with high strength and toughness is adopted, the back plate 20 will be formed as figure 2 As shown, due to the large residual stress of the back plate 20, the amount of springback is large, the precision of the product after assembly is low, and the backlight module is heavy; if the 5052 aluminum alloy widely used in TPC (Tablet Personal Computer, tablet computer) is used As a backplane material, due to the relatively low strength of 5052 aluminum alloy, there is a risk of deformation during the assembly, handling and transportation of the backlight module

[0003] At present, as an example, 6-series and 7-series aluminum alloys (such as 6061 and 7075) are often used as backboard materials. 6-series and 7-series aluminum alloys are high-strength aluminum alloys in aluminum alloys. Due to the high strength of these two types of aluminum alloys ( can reach the strength of steel), and the weight is low (about 1 / 3 of steel), so high-strength aluminum alloy is an ideal material for large-size display backplane, but the high-strength aluminum alloy is difficult to form at room temperature, and after forming Large rebound, which is not conducive to backlight module assembly

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