Preparation of high-temperature-resistant epoxy structural adhesive

A technology of epoxy structural adhesive and high temperature resistance, which is applied in the direction of epoxy resin glue, adhesive, non-polymer adhesive additives, etc., which can solve the problem of affecting product quality, overheating of epoxy adhesive and non-metallic bonding surface, and poor thermal conductivity and other issues, to achieve the effects of easy control, wide range of product uses, and low production costs

Inactive Publication Date: 2017-06-16
烟台鑫海耐磨胶业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Ordinary epoxy resin has poor thermal conductivity, which can easily cause overheating of the epoxy adhesive and non-metal bonding surface, resulting in internal stress and affecting product quality

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0007] Epoxy resin E-51 50g, F-51 50g and toughening agent KH-07A 2.5g, KH-07B 2.5g, KH-07C 2.5g, KH-07D 2.5g, γ-aminopropyl triethoxy Add 1g of silane to the mixing kettle, stir at room temperature for 1h, and rotate at 100rpm; add 5g of alumina powder, 10g of spherical aluminum powder, and 5g of microsilica powder at 1000rpm for 20 minutes, mix well and reduce to room temperature, add 3g of dicyandiamide, 100A 1g, PN-23 1g, stir at 100rpm for 30min, and get out.

Embodiment 2

[0009] Epoxy resin E-51 50g, F-51 50g and toughening agent KH-07A 2.5g, KH-07B 2.5g, KH-07C 2.5g, KH-07D 2.5g, γ-aminopropyl triethoxy Add 1g of silane to the mixing kettle, stir at room temperature for 2h, and rotate at 180rpm; add 5g of alumina powder, 10g of spherical aluminum powder, 5g of microsilica powder, at 1200rpm, stir for 40min, mix well and reduce to room temperature, add 3g of dicyandiamide, 100A 1g, PN-23 1g, stir at 180rpm for 30min, and get it out.

Embodiment 3

[0011] Epoxy resin E-51 50g, F-51 50g and toughening agent KH-07A 2.5g, KH-07B 2.5g, KH-07C 2.5g, KH-07D 2.5g, γ-aminopropyl triethoxy Add 1g of silane to the mixing kettle, stir for 1.5h at room temperature, at a speed of 150rpm; add 5g of alumina powder, 10g of spherical aluminum powder, 5g of microsilica powder, at a speed of 1000rpm, stir for 30min, mix well and reduce to room temperature, add 3g of dicyandiamide, 100A 1g, PN-23 1g, stir at 120rpm for 30min, and get it out.

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PUM

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Abstract

The invention relates to preparation of a high-temperature-resistant epoxy structural adhesive. The adhesive is prepared by adding 50 g of epoxy resin E-51, 50 g of epoxy resin F-51, 2.5 g of a flexibilizer KH-07A, 2.5 g of a flexibilizer KH-07B, 2.5 g of a flexibilizer KH-07C, 2.5 g of a flexibilizer KH-07D and 1 g of gamma-aminopropyltriethoxysilane into a mixing kettle and carrying out stirring at normal temperature for 1 to 2 h, with a rotating speed being 100 to 180 rpm; and adding 5 g of alumina powder, 10 g of spherical aluminum powder and 5 g of silica micropowder, carrying out stirring at a rotating speed of 1000 to 1200 rpm for 20 to 40 min, and carrying out cooling to normal temperature after uniform mixing; and adding 3 g of dicyandiamide, 1 g of 100A and 1 g of PN-23 carrying out stirring at a rotating speed of 100 to 180 rpm for 30 min, and then carrying out blanking.

Description

Technical field [0001] The invention relates to the preparation of a high temperature resistant epoxy structural adhesive, which belongs to the field of synthetic chemistry. Background technique [0002] Epoxy resin adhesives have excellent bonding properties and are widely used in bonding occasions. In some adhesive applications, one side is metal such as aluminum, and the other side is non-metal such as phenolic resin. Metal has good thermal conductivity, but non-metal has poor thermal conductivity, and there is a large gap between metal and non-metal. Add epoxy structural adhesive for bonding. Ordinary epoxy resin has poor thermal conductivity, which can easily cause overheating of the epoxy adhesive and non-metal bonding surface, which will cause internal stress and affect product quality. Summary of the invention [0003] The technical problem to be solved by the present invention is to provide a preparation of high temperature resistant epoxy structural adhesive. The techn...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/06C09J11/04
Inventor 阎珊珊
Owner 烟台鑫海耐磨胶业有限公司
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