Preparation of silver-copper powder electric conduction material
A conductive material, silver-copper powder technology, applied in the direction of conductive adhesives, epoxy resin adhesives, adhesive types, etc., can solve the problems of the increase in the proportion and price of silver-containing conductive adhesives, and achieve low production costs and easy Control, Product Wide Range of Effects
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Embodiment 1
[0008] Mix 15 parts of bisphenol F-type epoxy resin and 20 parts of neopentyl glycol glycidyl ether for 10 minutes until uniform, then add 10 parts of diaminodiphenylmethane and 8 parts of 3-aminopropyltriethoxysilane at room temperature Mix at low speed for 10 minutes to form a homogeneous mixture. After grinding by a three-roller machine, add 3 parts of silver-plated copper powder and 5 parts of silver-plated nickel powder. Apply vacuum and mix at low speed for 1 hour at room temperature to prepare silver-copper powder conductive material.
Embodiment 2
[0010] Mix 25 parts of bisphenol F-type epoxy resin and 20 parts of neopentyl glycol glycidyl ether for 30 minutes until uniform, then add 10 parts of diaminodiphenylmethane and 8 parts of 3-aminopropyltriethoxysilane at room temperature Mix at low speed for 30 minutes to form a homogeneous mixture. After grinding by a three-roller machine, add 5 parts of silver-plated copper powder and 5 parts of silver-plated nickel powder. Apply vacuum and mix at low speed for 3 hours at room temperature to prepare silver-copper powder conductive material.
Embodiment 3
[0012] Mix 20 parts of bisphenol F type epoxy resin and 20 parts of neopentyl glycol glycidyl ether for 20 minutes until uniform, then add 10 parts of diaminodiphenylmethane and 8 parts of 3-aminopropyltriethoxysilane, room temperature Mix at low speed for 20 minutes to form a homogeneous mixture. After grinding by a three-roller machine, add 4 parts of silver-plated copper powder and 5 parts of silver-plated nickel powder. Apply vacuum and mix at low speed for 2 hours at room temperature to prepare the silver-copper powder conductive material.
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