Preparation of silver-copper powder electric conduction material

A conductive material, silver-copper powder technology, applied in the direction of conductive adhesives, epoxy resin adhesives, adhesive types, etc., can solve the problems of the increase in the proportion and price of silver-containing conductive adhesives, and achieve low production costs and easy Control, Product Wide Range of Effects

Inactive Publication Date: 2017-06-16
烟台鑫海耐磨胶业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, with the increasing demand for precious metals such as silver in the industry, its price has been rising, resulting in a significant increase in the proportion of silver-containing conductive adhesives in the cost of LED packaging.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0008] Mix 15 parts of bisphenol F-type epoxy resin and 20 parts of neopentyl glycol glycidyl ether for 10 minutes until uniform, then add 10 parts of diaminodiphenylmethane and 8 parts of 3-aminopropyltriethoxysilane at room temperature Mix at low speed for 10 minutes to form a homogeneous mixture. After grinding by a three-roller machine, add 3 parts of silver-plated copper powder and 5 parts of silver-plated nickel powder. Apply vacuum and mix at low speed for 1 hour at room temperature to prepare silver-copper powder conductive material.

Embodiment 2

[0010] Mix 25 parts of bisphenol F-type epoxy resin and 20 parts of neopentyl glycol glycidyl ether for 30 minutes until uniform, then add 10 parts of diaminodiphenylmethane and 8 parts of 3-aminopropyltriethoxysilane at room temperature Mix at low speed for 30 minutes to form a homogeneous mixture. After grinding by a three-roller machine, add 5 parts of silver-plated copper powder and 5 parts of silver-plated nickel powder. Apply vacuum and mix at low speed for 3 hours at room temperature to prepare silver-copper powder conductive material.

Embodiment 3

[0012] Mix 20 parts of bisphenol F type epoxy resin and 20 parts of neopentyl glycol glycidyl ether for 20 minutes until uniform, then add 10 parts of diaminodiphenylmethane and 8 parts of 3-aminopropyltriethoxysilane, room temperature Mix at low speed for 20 minutes to form a homogeneous mixture. After grinding by a three-roller machine, add 4 parts of silver-plated copper powder and 5 parts of silver-plated nickel powder. Apply vacuum and mix at low speed for 2 hours at room temperature to prepare the silver-copper powder conductive material.

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PUM

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Abstract

The present invention relates to preparation of a silver-copper powder electric conduction material. The preparation comprises: mixing 15-25 parts of a bisphenol F type epoxy resin and 20 parts of neopentyl glycol glycidyl ether for 10-30 min to achieve a uniform state, adding 10 parts of diamino diphenyl methane and 8 parts of 3-aminopropyltriethoxysilane, mixing for 10-30 min at a room temperature to obtain a uniform mixture, grinding through a three-roller machine, adding 3-5 parts of silver plating copper powder and 5 parts of silver plating nickel powder, applying vacuum at a room temperature, and carrying out low speed mixing for 1-3 h so as to prepare the silver-copper powder electric conduction material.

Description

technical field [0001] The invention relates to the preparation of a silver-copper powder conductive material, which belongs to the field of synthetic chemistry. Background technique [0002] Most of the traditional conductive adhesives use silver powder as the conductive and thermal conductive filler, and the main part of the material cost is also silver powder. However, with the increasing demand for silver and other precious metals in the industry, their prices have been rising, resulting in a significant increase in the proportion of silver-containing conductive adhesives in the cost of LED packaging. Therefore, it is necessary to develop a type of conductive adhesive with lower cost, which has a cost acceptable to the market, and at the same time, its comprehensive performance can be close to or even equal to that of silver-containing conductive adhesive. Some conductive adhesive products have appeared in China, but silver powder is basically used as filler. [0003] ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/06C09J11/04C09J9/02
CPCC09J163/00C08K3/08C08K9/02C08K2003/085C08K2003/0862C09J9/02C09J11/04C09J11/06
Inventor 阎珊珊
Owner 烟台鑫海耐磨胶业有限公司
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