Rapid permeation bottom underfill and preparation method thereof

An underfill and fast technology, which is used in chemical instruments and methods, adhesives, epoxy resins, etc., can solve the problems of uneven rounding around the chip, slow filling speed, and more residual glue, etc., to achieve a wide range of products. , Improve work efficiency and low cost

Inactive Publication Date: 2014-04-16
HB FULLER CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It mainly solves the problems of slow filling speed of the existing underfill, excessive residual glue, poor fillet forming and uneven fillet forming around the chip

Method used

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  • Rapid permeation bottom underfill and preparation method thereof
  • Rapid permeation bottom underfill and preparation method thereof
  • Rapid permeation bottom underfill and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Embodiment 1: According to the following table and the following steps to prepare the rapid penetration underfill glue,

[0025] (1) Mix 35g DER331J epoxy resin (Dow), 35g EP-4901E (Japan Asahi Denka), 2g fumaric acid bisphenol A unsaturated polyester for pretreatment: heat up to 80°C and stir for 1.5 hours , cooled to 15°C;

[0026] (2) Add 16g of FXR1020 / FXR1081 curing agent (Fuji Kasei Japan) while stirring, continue stirring for 1 hour after adding, and control the temperature at 15°C;

[0027] (3) Add 11g DY-E (Dow) diluent, 0.5g KH550 (γ-aminopropyltriethoxysilane) coupling agent and 0.5g carbon black, stir at 15°C for 1 hour to obtain rapid penetration Underfill glue.

[0028]

[0029]

Embodiment 2

[0030] Embodiment 2: According to the following table and the following steps to prepare rapid penetration underfill glue,

[0031] (1) Mix 10g alicyclic epoxy resin, 65g EP-4901E (Japan Asahi Denka), 6g fumaric acid bisphenol A unsaturated polyester for pretreatment, heat up to 100°C, stir for 2.5 hours, and cool down to 30°C;

[0032] (2) Add 18g of PN-H (Ajinomoto) curing agent while stirring, continue stirring for 1 hour after adding, and control the temperature at 30°C;

[0033] (3) Add 6g E-10 (Shell, glycidyl tert-carbonate) diluent, 0.8g KH550 (γ-aminopropyltriethoxysilane) coupling agent and 1g carbon black, and stir at 30°C for 1 Hours to get fast penetrating underfill.

[0034]

Embodiment 3

[0035] Embodiment 3: According to the following table and the following steps to prepare the rapid penetration underfill glue,

[0036] (1) Mix 15g DER331J (Dow), 40g EP-4901E (Japan Asahi Denka), 12g alicyclic epoxy resin and 3g fumaric acid bisphenol A unsaturated polyester for pretreatment, and heat up to 90°C degree, stirred for 2 hours, and cooled to 20°C;

[0037] (2) Add 15g of PN-H (Ajinomoto) curing agent while stirring, continue stirring for 1 hour after adding, and control the temperature at 25°C;

[0038] (3) Add 14.5g DY E (Dow, monoglycidyl ether of C12-C14 alcohol) diluent, 0.5g KH560 (glycidoxytrimethoxysilane) coupling agent, and stir at 20°C for 1 hour Get fast penetrating underfill.

[0039]

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PUM

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Abstract

The present invention discloses a rapid permeation bottom underfill and a preparation method thereof. The underfill comprises, by weight, 2-10% of an unsaturated polyester, 20-80% of a liquid epoxy resin, 0-20% of a diluent agent, 5-20% of a curing agent, 0-5% of a coupling agent and 0-3% of a pigment. The preparation method comprises: carrying out a mixing pretreatment on the liquid epoxy resin and the unsaturated polyester, heating to a temperature of 80-100 DEG C, stirring for 1.5-2.5 hours, cooling to the temperature of 15-30 DEG C, adding the curing agent, stirring for 1 hour at the temperature of 15-30 DEG C, adding the diluent agent, the coupling agent and the pigment, and stirring for 1 hour at the temperature of 15-30 DEG C. The product of the present invention can rapidly and completely permeate under the high viscosity condition, no residue exists on the position of underfill applying, the underfill liquids on four edges of the chip present uniform and best fillets, and the production efficiency and the impact resistance are improved.

Description

technical field [0001] The invention relates to a bottom filling glue, in particular to a fast permeable bottom filling glue and a preparation method thereof, which are suitable for packaging technologies such as BGA, CSP and POP. Background technique [0002] The role of the underfill is to protect the connection solder joints between the two surfaces. For flip chips, the underfill can reduce the strain caused by the different thermal expansion coefficients of each interconnection. For packages such as BGA, CSP and POP, the use of underfill glue between the circuit board and the package can fully reduce the strain caused by mechanical vibration on each interconnection part. [0003] At present, the most commonly used underfill is capillary underfill, and its dispensing methods are as follows: [0004] a. The dispensing style is to place a point on one corner of the chip or the midpoint of a certain side. It is suitable for small chips, or applications where it is easier t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/02C09J163/00C09J167/06C09J11/00C09K3/10
Inventor 李峰
Owner HB FULLER CO
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