A dust-proof heat dissipation box for a chassis

Abstract

The invention relates to a dustproof cooling box used for a case, and can solve the problem of poor cooling and dustproof effects of an existing case. A ventilation plate is mounted on a bottom plate; first through holes are formed in the ventilation plate; second through holes are formed in the left sides of the first through holes; the diameter of each first through hole is greater than that of each second through hole; baffles are arranged at the right end openings of the first through holes; ventilation holes are formed in the baffles; push rods are inserted in the baffles; seal blocks are arranged at the left ends of the push rods; the length of each seal block is greater than that of each second through hole; the push rods are sleeved with springs arranged between the seal blocks and the baffles; a fixing plate is arranged on the left side surface of the ventilation plate; first sponge is arranged on the left side of the fixing plate; second sponge is arranged on the left side of the first sponge; a filtering cavity is formed between the first sponge and the second sponge; an airflow channel is formed in the first sponge; through holes are formed in the fixing plate; ventilation push rods are mounted on the through holes and correspond to the second through holes; and the right ends of the ventilation push rods extend out of the fixing plate. The cooling box is novel and unique in structure; and flowing cooling wind is formed in the case, so that the cooling problem of the case is well solved.

Description

technical field [0001] The invention relates to a computer, in particular to a dust-proof and heat-dissipating box for a chassis. Background technique [0002] Now the amount of data processing is increasing, the required processor computing speed and capacity are also large, and the heat generated is relatively large. If the ambient temperature rises, the processing speed of the processor will be reduced. The current chassis generally have a common heat dissipation structure. In the case of a large processing volume, a cooling fan with a higher power is used, because the current chassis has no sealing. Protective measures, the host has many air inlets, and under the action of the existing fan, no flowing cooling air can be formed inside the case, resulting in many components not being well cooled, and dust is easy to accumulate inside the case. Dust will cause short circuit of electronic components, which will cause considerable safety hazards to the use of equipment and a...

AI Technical Summary

Problems solved by technology

[0003] In view of the above situation, in order to overcome the problems existing in the structure of the existing chassis, the present invention provides a dust-proof heat dissipation box for the chassis, which can effectively solve the problem of poor heat dissipation and dust-proof effect of the existing chassis

Images