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Method for preparing nanometer silver line circuit board by light printing

A nano-silver wire and circuit board technology, applied in the direction of conductive pattern formation, etc., can solve the problems of easily clogged nozzles, nano-silver particles are not suitable for repeated folding of flexible substrates, etc., and achieve the effect of avoiding waste and avoiding easy clogging

Active Publication Date: 2017-07-14
BEIJING INSTITUTE OF PETROCHEMICAL TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Inkjet printing also has its limitations. The resin material used is not only easy to block the nozzle after the curing of the resin material after stopping inkjet for a long time, but also the contact of nano-silver particles is not suitable for repeated folding of flexible substrates.

Method used

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  • Method for preparing nanometer silver line circuit board by light printing
  • Method for preparing nanometer silver line circuit board by light printing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] The method for preparing nano-silver circuit boards by optical printing in this embodiment comprises the following steps:

[0040] First, a layer of photosensitive resin was coated on the cleaned glass slide with a 10 μm Meyer rod under dark room conditions. Place the slide glass under the designed ultraviolet light for selective point-by-point exposure treatment, set the power of the ultraviolet beam to 200mW, the scan rate to 6mm / s, and the number of exposures to 1 time. Clean the uncured photosensitive resin.

[0041] Use a 100μm scraper rod to scrape a layer of nano-silver wire wet film on the glass slide substrate that has been coated with resin. After the solvent ethanol is fully volatilized, that is, the nano-silver wire alcohol solution no longer has fluidity. , placed under a hot press for processing, the hot pressing pressure is 50kg, the hot pressing temperature is 180°C, and the hot pressing time is 1min.

[0042] After the glass slide is cooled, it is tak...

Embodiment 2

[0044]The method for preparing nano-silver circuit boards by optical printing in this embodiment comprises the following steps:

[0045] First, a layer of photosensitive resin was coated on a cleaned PET sheet with a 10 μm Meyer rod under dark room conditions. Place the PET sheet under the designed ultraviolet light for selective point-by-point exposure treatment, set the power of the ultraviolet beam to 180mW, the scan rate to 4mm / s, and the number of exposures to 1 time. Clean the uncured photosensitive resin.

[0046] Use a 100 μm scraping rod to scrape a layer of nano-silver wire wet film on the resin-coated PET sheet substrate. After the solvent ethanol is fully volatilized, that is, when the nano-silver wire alcohol solution no longer has fluidity, Put it into a hot press for processing, the hot pressing pressure is 50kg, the hot pressing temperature is 160°C, and the hot pressing time is 3min.

[0047] After the PET sheet is cooled, it is taken out, and the nano-silve...

Embodiment 3

[0049] The method for preparing nano-silver circuit boards by optical printing in this embodiment comprises the following steps:

[0050] First, a layer of photosensitive resin was coated on the cleaned glass slide with a 10 μm Meyer rod under dark room conditions. Paste the slide glass on the film sheet that has already been patterned, and perform exposure processing under an exposure machine with an intensity of 1kW. Clean the uncured photosensitive resin.

[0051] Use a 100μm scraper rod to scrape a layer of nano-silver wire wet film on the glass slide substrate that has been coated with resin. After the solvent ethanol is fully volatilized, that is, the nano-silver wire alcohol solution no longer has fluidity. , put it into a hot press machine for processing, the hot pressing pressure is 50kg, the hot pressing temperature is 160°C, and the hot pressing time is 3min.

[0052] After the glass slide is cooled, it is taken out, and the nano-silver wires that have not been ho...

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Abstract

The invention discloses a method for preparing a nanometer silver line circuit board by light printing. The method comprises steps of coating a layer of photosensitive resin on the surface of a cleaned substrate to form a photosensitive resin layer, subjecting a computer-designed circuit pattern to exposure and solidification on the photosensitive resin layer by laser or an exposure machine, and forming the same pattern as the circuit pattern on the solidified photosensitive resin layer; and cleaning the surface of the substrate to remove the non-solidified photosensitive resin; coating a layer of nanometer silver line solution on the solidified photosensitive resin pattern, and after the solvent of the nanometer silver line solution is volatilized, placing the substrate with the photosensitive resin pattern and the nanometer silver line under a hot press for high temperature hot pressing, embedding the nanometer silver line in the surface of the photosensitive resin pattern, and then performing cleaning and recovering the non-hot-pressed nanometer silver line on the surface of the photosensitive resin pattern, so as to prepare the nanometer silver line circuit board. The device employed in the method is simple and easy to operate, the preparation is convenient, and the method is applicable to batch production and customized preparation.

Description

technical field [0001] The invention relates to the field of circuit board preparation, in particular to a method for preparing a nano-silver wire circuit board by optical printing. Background technique [0002] With the rapid development of electronic equipment manufacturing, circuit boards are in great demand as an essential part of electronic equipment. At present, the most common manufacturing processes of circuit boards include wet chemical etching of copper clad laminates and dry etching of conductive films. These two circuit board preparation methods are all subtractive manufacturing processes, and the waste liquid or waste residue produced by them is difficult to recycle, causing a lot of waste and causing great pollution to the environment. In order to overcome the disadvantages of waste and pollution in the subtractive preparation process, in recent years, some researchers have proposed the use of inkjet printing technology to prepare circuit boards. Inkjet print...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/12
Inventor 武光明冯懂懂
Owner BEIJING INSTITUTE OF PETROCHEMICAL TECHNOLOGY