Shell and manufacturing method therefor, and terminal equipment

A manufacturing method and housing technology, applied in the electronic field, can solve the problems of unfavorable thin and portable design of mobile terminals, wide mobile terminal machine width, and high cost, so as to save FPC boards and connectors, save installation space, and save costs Effect

Inactive Publication Date: 2017-07-14
SHANGHAI YUDE TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, the inventors have found that there are still the following problems in the prior art. In the prior art, the FPC board is usually composed of 0.1mm FPC, 0.2mm reinforcement board and 0.05mm conductive glue. The FPC board of the side key passes through the connector It is connected with the main board, which leads to a wider width of the mobile terminal, which is not conducive to the thin and light portable design of the mobile terminal, and at the same time, the cost is higher

Method used

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  • Shell and manufacturing method therefor, and terminal equipment
  • Shell and manufacturing method therefor, and terminal equipment
  • Shell and manufacturing method therefor, and terminal equipment

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Embodiment Construction

[0020] In order to make the objectives, technical solutions, and advantages of the present invention clearer, the various embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, a person of ordinary skill in the art can understand that, in each embodiment of the present invention, many technical details are proposed for the reader to better understand the present application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical solution claimed in this application can be realized.

[0021] The first embodiment of the present invention relates to a manufacturing method of a housing, such as figure 1 Shown:

[0022] Step 101: Injection molding the shell.

[0023] Specifically, the use of injection molding technology to inject metal or non-metal materials into the shell according to the shell model is consistent with the prior art and wil...

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Abstract

The invention relates to the technical field of electronics, and discloses a shell and a manufacturing method therefor, and terminal equipment. The manufacturing method for the shell comprises the steps of performing injection molding on the shell; arranging at least one conductive routing layer on the shell; printing at least one bonding pad in a preset position of the shell; and welding an electronic component on the bonding pad, wherein the conductive routing layer is used for realizing electrical connection of the corresponding electronic component to a main board. Embodiments of the invention also disclose the shell and the terminal equipment. The complete machine width of the terminal equipment can be reduced while cost can be lowered.

Description

Technical field [0001] The present invention relates to the field of electronic technology, and in particular to a manufacturing method of a housing, a housing and a terminal device. Background technique [0002] In recent years, with the continuous development of communication technology and the continuous advancement of technology, mobile terminals such as mobile phones, tablet computers, or notebook computers have become indispensable tools in people's daily life. At present, the side keys in mobile terminals are generally hot-melted to the back shell, flexible printed circuit (FPC) is attached to the front shell, and the FPC of the side key passes through zero insertion force (Zero Insertion Force, zif). A connector or a board-to-board (BTB) connector is connected to the motherboard. [0003] However, the inventor found that the following problems still exist in the prior art. In the prior art, the FPC board is usually composed of 0.1mm FPC, 0.2mm reinforcement board and 0.05m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/02H05K3/12H05K3/34
CPCH05K5/0247H05K3/12H05K3/34
Inventor 周保国王帆徐铖
Owner SHANGHAI YUDE TECH CO LTD
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