Alkenyl-and-esteryl-containing compound, preparation method of alkenyl-containing esteryl compound and bismaleimide resin modified by alkenyl-containing esteryl compound

A bismaleimide resin and bismaleimide technology are applied in the field of alkenyl ester-containing compounds and their preparation and modified bismaleimide resins, which can solve the problem of high water absorption , high curing temperature, low bonding strength and other problems, to achieve the effect of increasing water absorption, reducing curing reaction temperature and time, and reducing water absorption

Active Publication Date: 2017-07-25
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The present invention aims to solve the problems of existing bismaleimide resins with high water absorption rate, low bonding strength and high curing temperature after curing under high temperature and high humidity, and provides an alkenyl ester group-containing compound and a preparation method thereof And the bismaleimide resin modified by it

Method used

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  • Alkenyl-and-esteryl-containing compound, preparation method of alkenyl-containing esteryl compound and bismaleimide resin modified by alkenyl-containing esteryl compound
  • Alkenyl-and-esteryl-containing compound, preparation method of alkenyl-containing esteryl compound and bismaleimide resin modified by alkenyl-containing esteryl compound
  • Alkenyl-and-esteryl-containing compound, preparation method of alkenyl-containing esteryl compound and bismaleimide resin modified by alkenyl-containing esteryl compound

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specific Embodiment approach 1

[0030] Specific embodiment one: the general structural formula of a kind of alkenyl ester group-containing compound of the present embodiment is:

[0031]

[0032] The R 1 for

[0033]

[0034]The R 2 for -CH=CH-CH 3 or -CH 2 -CH=CH 2 .

[0035] The beneficial effect of this embodiment is: an alkenyl ester group-containing compound prepared in this embodiment. First, the polymerization of diallyl bisphenol A and bis-hormone will first undergo ENE addition and "Diels–Alder" reaction. Due to the presence of weak links with poor heat resistance in the structure of diallyl bisphenol A, such as -C(CH 3 ) 2 -, the lower thermal decomposition temperature and glass transition temperature have seriously affected the high-temperature use effect of Shuangma. At the same time, the presence of terminal hydroxyl groups greatly increases the water absorption of the material. After the alkenylphenyl ester group-containing compound reacts with double horses, the molecular chain...

specific Embodiment approach 2

[0038] Specific embodiment two: the preparation method of a kind of alkenyl ester group-containing compound described in this embodiment is carried out according to the following steps:

[0039] Mix terephthaloyl chloride and 2-alkenylphenol to obtain a mixture, then add the mixture and catalyst to the solvent and stir for 10h to 20h to obtain a reaction system, raise the temperature of the reaction system to 60°C to 80°C, and Under the condition of ℃~80℃, react for 1h~5h, then raise the temperature of the reaction system to 100℃~140℃, and react for 2h~6h under the condition of temperature 100℃~140℃, and then cool down to room temperature after the reaction. To obtain a crude product, filter the crude product with a 200-800-mesh drying screen, add ethanol to the filtrate for 3h-5h, filter the precipitated solution to obtain a precipitate, and then wash the precipitate with methanol for 3 to 5 hours times, and finally dried to obtain the alkenyl ester group-containing compound;...

specific Embodiment approach 3

[0041] Specific embodiment three: the difference between this embodiment and specific embodiment two is: the terephthaloyl dichloride is

[0042]

[0043]

[0044] Others are the same as in the second embodiment.

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Abstract

The invention, discloses an alkenyl-and-esteryl-containing compound, a preparation method of the alkenyl-containing esteryl compound and bismaleimide resin modified by the alkenyl-containing esteryl compound, and relates to a compound, a preparation method thereof and bismaleimide resin modified by the compound. The invention aims at solving the problems of the existing bismaleimide resin that the water absorption rate is high; the bonding strength is low at high temperature and high damp and hot environment after curing; the curing temperature is high. A general structure formula is shown in the desciption. The preparation method is characterized in that terephthalyl chloride, 2-alkenyl phenol and a catalyst are added into a solvent; temperature rise reaction is performed; after the reaction, temperature reduction, filtering, precipitation, filtering, methanol washing and drying are performed. The bismaleimide resin modified by the alkenyl-and-esteryl-containing compound is prepared from bismaleimide and the alkenyl-and-esteryl-containing compound.

Description

technical field [0001] The invention relates to a compound, a preparation method thereof and a modified bismaleimide resin using the same. Background technique [0002] Thermosetting resins are widely used in aerospace, electronics and other fields. Bismaleimide (BMI) is a typical representative of high-performance thermosetting resins. As a matrix resin, it can meet the requirements of high-speed and high-frequency printed circuit board substrates. . Bismaleimide resin has a higher Tg after curing, and has the advantages of good mechanical properties, heat resistance, heat and humidity resistance, and solvent resistance. Therefore, bismaleimide is a resin for printed wiring boards that is used at a temperature higher than that of epoxy resins. However, after curing itself, the material is brittle and poor in manufacturability, so it must be modified. However, bismaleimide is commonly polymerized with diallyl bisphenol A and N,N'-4,4'-diphenylmethane bismaleimide. Howeve...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/12C08L79/08C08L61/28C08K7/14C08K5/098C08K3/36C08K5/1515C08K5/315
CPCC08G73/123C08G73/126C08G73/127C08K3/36C08K5/098C08K5/1515C08K5/315C08K7/14C08L79/08C08L2201/08C08L61/28
Inventor 刘长威肖万宝曲春艳王德志冯浩李洪峰张杨刘士琦王海民
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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