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A thermally conductive material and its preparation method and application

A technology for thermally conductive materials and substrates, which is applied in the field of polymer material preparation and can solve problems such as insufficient thermal conductivity of thermally conductive materials

Active Publication Date: 2019-02-12
东莞市普万光电散热科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The existing technology generally improves the thermal conductivity of the material by adding carbon-based materials, metals or metal oxides to the material. However, due to the problem of contact mode and dispersion degree, the thermal conductivity of the existing thermal conductive materials is still insufficient and needs to be developed urgently. Materials with greater thermal conductivity

Method used

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  • A thermally conductive material and its preparation method and application
  • A thermally conductive material and its preparation method and application
  • A thermally conductive material and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058] Dosing according to the following components:

[0059] 52 parts of substrate; 30 parts of graphite powder; 7 parts of isomeric alcohol ether; 5 parts of graphene oxide; 3 parts of coupling agent; 2.5 parts of toughening agent; 0.3 parts of lubricant; 0.2 parts of fireproofing agent.

[0060] The substrate is made of polyamide, the isomeric alcohol ether is made of isomeric decanol polyoxyethylene ether, the coupling agent is made of silane coupling agent Z-601, the toughening agent is made of chlorinated polyethylene, and the lubricant is made of ethylene dihard Fatty amide, polyvinyl chloride is used as fire retardant.

[0061] Prepare the thermally conductive material as follows:

[0062] (1) Add the graphite powder, graphene oxide and isomeric decanol polyoxyethylene ether into the high-speed mixer, mix at 90°C for 15 minutes, and then add the mixture into the twin-screw extruder;

[0063] (2) Add the polyamide, silane coupling agent Z-601, ethylene bisstearamide, ...

Embodiment 2

[0066] Dosing according to the following components:

[0067] 45 parts of substrate; 28 parts of graphite powder; 10 parts of isomeric alcohol ether; 8 parts of graphene oxide; 5 parts of coupling agent; 3 parts of toughening agent; 0.5 part of lubricant; 0.4 part of fireproofing agent.

[0068] The substrate is made of polyethylene resin, the isomeric alcohol ether is made of isomeric undecyl alcohol polyoxyethylene ether, the coupling agent is made of silane coupling agent KH550, the toughening agent is made of chlorinated polyethylene, and the lubricant is made of polyethylene wax. The fire retardant is chlorinated paraffin.

[0069] Prepare the thermally conductive material as follows:

[0070] (1) Add the graphite powder, graphene oxide and isomerized undecyl alcohol polyoxyethylene ether into the high-speed mixer, mix at 100°C for 10 minutes, and then add the mixture to the twin-screw extruder;

[0071] (2) Add the polyethylene resin, silane coupling agent KH550, chlor...

Embodiment 3

[0074] Dosing according to the following components:

[0075] 60 parts of substrate; 25 parts of graphite powder; 5 parts of isomeric alcohol ether; 3 parts of graphene oxide; 5 parts of coupling agent; 1.5 parts of toughening agent; 0.1 part of lubricant;

[0076] The base material is polytrimethylene terephthalate, the isomeric alcohol ether is tridecanol polyoxyethylene ether, the coupling agent is silane coupling agent KH570, the toughening agent is EPDM rubber, and the lubricant is Polyethylene wax is used, and chlorinated paraffin is used as fire retardant.

[0077] Prepare the thermally conductive material as follows:

[0078] (1) Add the graphite powder, graphene oxide and isomeric tridecanol polyoxyethylene ether into the high-speed mixer, mix at 70°C for 20 minutes, and then add the mixture into the twin-screw extruder;

[0079] (2) Add the amount of polytrimethylene terephthalate, silane coupling agent KH570, EPDM rubber, polyethylene wax and chlorinated paraffin ...

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Abstract

The invention relates to a heat conduction material and a preparation method and application thereof. The heat conduction material is prepared from the following components in parts by mass: 40 to 60 parts of substrate, 25 to 30 parts of graphite powder, 3 to 10 parts of heterogeneous alcohol ether, 3 to 8 parts of graphene oxide, and 2 to 5 parts of coupling agent, wherein the substrate is any one of polyamide, polypropylene, polyethylene resin, polytrimethylene terephthalate, polybutylene terephthalate or polyphenylene sulfide; a toughening agent, a fire-proofing agent and a lubricating agent is added optionally. The heat conduction material is prepared by polymerizing and molding at a high temperature through a twin screw extrusion process. The prepared heat conduction material has superior heat-conducting property, and the heat conductivity coefficient can be up to 11w / mk; the heat conduction material can replace a part of conventional metal products to realize lightening of products; the heat conduction material can achieve a good heat-dissipation function when being applied to a high-power heat-dissipation product, and has a good economic benefit and a wide application prospect.

Description

technical field [0001] The invention relates to the field of polymer material preparation, in particular to a heat-conducting material and its preparation method and application. Background technique [0002] High-power heat dissipation products, especially electronic components, will generate a lot of heat as the working time prolongs in the working state. If the heat cannot be dissipated in time, it will accumulate inside the product, and at least affect the performance of the components themselves. Accelerate the aging speed of the material, shorten its service life, and burn out the components, causing accidents and causing heavy losses. [0003] In the prior art, the problem of heat dissipation is generally solved by adding structural components with heat dissipation function to the product. For example, CN105848453A discloses a heat sink for high-power components, and the purpose of dissipating heat is achieved by adding a heat sink to high-power components. However,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L77/00C08L23/28C08L27/06C08L71/02C08L23/06C08L67/02C08L23/16C08L91/06C08L81/02C08K3/04C08K5/20C08K5/54C08K5/544C08K5/5425
CPCC08K2201/014C08L23/06C08L67/02C08L77/00C08L81/02C08L2205/025C08L2205/03C08L2205/035C08L23/28C08L27/06C08L71/02C08K3/04C08K5/20C08K5/54C08K5/544C08L23/16C08L91/06C08K5/5425
Inventor 靳涛
Owner 东莞市普万光电散热科技有限公司