Apparatus and method for planarizing multiple shadow masks on a common carrier frame

Abstract

The invention discloses an apparatus and method for multi-mask alignment. In an apparatus and method for multi-mask alignment, a carrier is provided that includes apertures therethrough. For each aperture, a combination frame and shadow mask that includes alignment features is positioned on spacers supported by the carrier with the shadow mask of the combination in coarse alignment with the aperture. Next, each combination frame and shadow mask is moved to a position spaced from the spacers whereupon the alignment system, under the control of a controller, individually aligns each combination frame and shadow mask to align the alignment features of the combination with reference alignment features associated with the combination. Each combination frame and shadow mask is then returned to a position on the spacers whereafter each combination frame and shadow mask is secured to the carrier. In an example, all of the combination frames and shadow masks can be aligned simultaneously.

Description

technical field [0001] The invention relates to planarizing each instance of a combined frame and shadow mask mounted on a carrier frame and planarizing a plurality of combined frames and shadow masks mounted on a carrier frame relative to each other. Background technique [0002] In the field of shadow mask vapor deposition, there is a trend to use larger and larger area shadow masks comprising one or more openings corresponding to a desired pattern of material to be deposited on a substrate from a deposition source. However, a problem that arises from forming shadow masks of larger and larger area sizes is how to avoid continuous errors in positioning openings across the size of the shadow mask. In other words, the problem that arises from forming shadow masks of larger and larger area sizes is that it becomes increasingly difficult to maintain spacing between the openings used to deposit patterns of material on the substrate across the size of the shadow mask. Precise di...

AI Technical Summary

Problems solved by technology

However, the problem that arises from forming shadow masks of larger and larger area sizes is how to avoid continuation errors when positioning openings across the size of the shadow mask

In other words, the problem that arises from forming shadow masks of larger and larger area sizes is that it becomes increasingly difficult to maintain spacing between the openings used to deposit patterns of material on the substrate across the size of the shadow mask. Precise Dimensional Stability

In the absence of a carrier frame with such a flat surface or plane, there is the possibility that the contact surface of each shadow mask and the substrate on which the deposition event will take place is not parallel or not substantially parallel, and therefore between said surfaces One or more unintended gaps are formed between the gaps, and then, during a deposition event via the apertures in the shadow mask, vapor-deposited material may undesirably enter these gaps and be deposited in the shadow mask defining said gaps. on one or both of the surface of the mold and the surface of the substrate, which is an undesirable condition

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