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Clamp used for automatic wedge bonding machine

A bonding machine and wedge welding technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of inability to realize matrix production, incompatibility of product fixtures, long fixture production cycle, etc., and achieve favorable heat Dispersion, a wide range of use, and the effect of saving the cycle of fixtures and production

Active Publication Date: 2017-08-11
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Similar bonding fixture design patents: "A Wire Bonding Fixture" (China CN102446803 A 2012.05.9), "Flexible Ultrasonic Wire Bonding Fixture" (China CN102335893B 2014.02.26), "A Bonding Fixture" (China CN104517881A 2015.04.15), the above design or complex structure requires gear transmission or the use of springs to clamp the components to be bonded, or is only suitable for a single product, which brings problems that the fixture production cycle is long or the fixtures of different products are not compatible. And matrix production cannot be realized, so these bonding fixtures cannot be applied in automated production

Method used

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  • Clamp used for automatic wedge bonding machine
  • Clamp used for automatic wedge bonding machine
  • Clamp used for automatic wedge bonding machine

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] It includes a base 1, a device carrier 5 and several positioning blocks 9; the device carrier 5 is placed on the base 1, and the positioning block 9 is placed on the device carrier 5; the base 1 is provided with several screw positioning holes connected to the device 2; the front of the base 1 is provided with a first vacuum hole 3; the device carrier 5 is provided with more than two bonding device positioning units; The matching positioning block 9 and at least one second vacuum hole 6 ; the second vacuum hole 6 communicates with the first vacuum hole 3 through the second vacuum groove provided on the back of the device carrier 5 .

[0026] The first vacuum hole 3 is one, and the second vacuum groove connects the first vacuum hole 3 with the second vacuum hole 6 to play the role of drainage; the base 1 is used to fix the device carrier 5; the positioning block 9 is used to fix the key combination device.

[0027] The positioning block 9 cooperates with the positioning...

Embodiment 2

[0030] The structure and assembly of the base 1 , the device carrier 5 and the positioning block 9 are the same as those in the first embodiment.

[0031] The device carrier 5 is divided into a left device carrier and a right device carrier, one of which covers the first vacuum hole 3; both the left device carrier and the right device carrier are provided with independent positioning units.

[0032] When in use, the left device carrier is placed on the first vacuum hole 3, the left device carrier is bonded first, and the right device carrier is preheated. After the left device carrier is completed, the left device carrier is Remove the device carrier, slide the device carrier on the right side onto the first vacuum hole 3 on the base 1, and perform bonding of the bonding device on the device carrier on the right side.

[0033] The arrangement of two device carriers enables cyclic production, while one is produced and the other can be preheated and loaded and unloaded, which im...

Embodiment 3

[0036] The structure and assembly of the base 1 , the device carrier 5 and the positioning block 9 are the same as those in the first embodiment.

[0037] More than two bonding device positioning units are arranged in a matrix.

[0038] The second vacuum hole 6 and the positioning counterbore 7 are divided into several positioning units, and the positioning units are arranged in a matrix. The position distribution of the second vacuum hole 6 and the positioning counterbore 7 is obtained through calculation, which meets the requirements of the existing devices to be bonded; through optimized calculation, the second vacuum hole 6 and the positioning unit in the device carrier 5 are obtained. The location distribution of the positioning counterbores 7, and then the positioning units are arranged in a matrix in the device carrier 5, and the automatic bonding machine has the function of matrix bonding, and the second vacuum hole 6 of each positioning unit and the positioning counte...

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PUM

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Abstract

The invention discloses a clamp used for an automatic wedge bonding machine, and relates to the semiconductor packaging technology field. The clamp comprises a base, a device supporting body, and a plurality of positioning blocks. The device supporting body is disposed on the base, and the positioning blocks are disposed on the device supporting body. The base is provided with a plurality of screw positioning holes connected with equipment, and the front surface of the base is provided with a first vacuum hole. The device supporting body is provided with more than two bonding device positioning units, each of which comprises a plurality of positioning countersinks, the positioning blocks cooperated with the positioning countersinks, and at least one second vacuum hole. The second vacuum holes are communicated with the first vacuum hole by a second vacuum groove disposed in the back surface of the device supporting body. The clamp is adapted to different products, and has advantages of simple structure, convenient use, wide application range, and abilities of saving materials and improving working efficiency.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging. Background technique [0002] With the expansion of the production scale of semiconductor devices, automatic wedge bonding machines are more and more widely used in the bonding process. The jig of automatic bonding equipment plays an important role in giving full play to the advantages of automatic equipment such as stability and high efficiency. The quality of the jig design will even affect the production capacity of an automatic equipment. Most automatic bonding machine equipment manufacturers have a single fixture structure and poor production versatility. At present, there is no patent for fixtures for automatic wedge bonding machines in China. Similar bonding fixture design patents: "A Wire Bonding Fixture" (China CN102446803 A 2012.05.9), "Flexible Ultrasonic Wire Bonding Fixture" (China CN102335893B 2014.02.26), "A Bonding Fixture" (China CN104517881A 2015.04.15), the a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/683
CPCH01L21/67092H01L21/67103H01L21/6838
Inventor 杨建军
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP