Thin PCB electroplating carrying device

Abstract

The invention provides a thin PCB electroplating carrying device which comprises an electroplating rack and fixed frames. Each fixed frame is square or rectangular. Multiple first clips are evenly arranged on the electroplating rack in the transverse direction. The size of each thin board is consistent with that of the corresponding fixed frame. The outer edge of each fixed frame is flushed with the corresponding thin board. One side of each fixed frame and one side of the corresponding thin board are mounted on the electroplating rack through the clamping function of the corresponding first clips. The other three sides of each fixed frame and the other three sides of the corresponding thin board are clamped and fixed through second clips.

Description

technical field [0001] The invention relates to a PCB sheet electroplating carrying device. Background technique [0002] With the development of science and technology, in the competition of the electronic product market, the volume required by various electronic products is getting smaller and smaller, and the interface density contained in various boards is getting higher and higher, and the corresponding modules are developing towards highly integrated small packages. It is required that the PCB develop in the direction of thin, light and small. [0003] Most printed circuit boards (PCBs) or their substrate processing equipment have requirements for product board thickness. Usually when the board thickness is less than 0.6mm, PCB or its substrates are prone to deformation due to thin boards, and it is difficult to process in most processes; Especially in the process of electroplating and horizontal line production, thin plates or flexible plates must be produced on sepa...

AI Technical Summary

Problems solved by technology

[0011] In the electroplating process of PCB or its substrate processing process, due to the high resistance of the copper foil on the surface of the product, according to the existing common unilateral clamping method, the fixture and the production board are in unilateral contact, and the contact area between the clamping point and the production board is small, and the resistance Larger, the current distribution is not uniform; thus it will affect the uniformity of the thickness distribution of electroplated copper, and it is time-consuming and labor-intensive to attach the carriage when crossing the horizontal line, and it is easy to be jacked up at the nozzle and drying place and jam the board

[0012] Because the thin plate is easy to bend, special production equipment and fixtures are required in the production process, especially the electroplating process (immersion copper, electroplating), and the horizontal line; it cannot be produced on the PCB equipment at the same time as the hard plate; if the thick plate, Thin plate needs to purchase two sets of production equipment, which increases the production cost

The uniformity of electroplating is poor, which cannot meet the quality requirements of high-precision circuits; the grade of the product cannot be improved; not only the cost is high, but also the operation is cumbersome, and the use of the drag plate over the horizontal line is easy to be pushed on the nozzle and drying place get stuck

[0013] In the prior art, there is a component with a screw fixing knob to lock the PCB board, which is not only expensive, but also cumbersome to operate. The screw that needs to be rotated is likely to be plated with copper during the electroplating process and cannot be screwed.

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