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Electronic circuit component

A technology of electronic components and electronic circuits, applied in the direction of circuits, electrical components, electric solid devices, etc., can solve problems such as stress applied to electronic components, deformation of cover components, lead frame and electronic components cut off, etc.

Inactive Publication Date: 2017-08-18
DENSO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] Here, the present inventors found out that there is a problem that the cover member may be pressed and deformed from the outside by the pressure when passing through the overmold, and stress may be applied to the electronic part.
It is also considered that the connection between the lead frame and the electronic component may be cut off due to stress applied to the electronic component.

Method used

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  • Electronic circuit component
  • Electronic circuit component
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Experimental program
Comparison scheme
Effect test

no. 1 approach

[0031] Such as Figure 1 to Figure 8 As shown, the electronic circuit component of the first embodiment includes electronic components A and B, a lead frame 1 , a resin component 2 , and a first cover member 8 . The electronic components A and B are elements constituting an electronic circuit, and are, for example, capacitors, resistors, or ICs enclosed in packages. In the first embodiment, the electronic component A is a capacitor or a resistor element, and the electronic component B is an IC.

[0032] Such as figure 2 As shown, the lead frame 1 is a conductive planar wiring, and a circuit pattern corresponding to the electronic components A and B to be mounted is formed. The lead frame 1 is, for example, a circuit forming member formed by demolding a conductive alloy plate. Part of the lead frame 1 is disposed inside the resin component 2 by insert molding. The lead frame 1 is composed of a plurality of lead parts 11 . The lead portion 11 constitutes wiring for connect...

no. 2 approach

[0056] The electronic circuit component of the second embodiment differs from the first embodiment mainly in that the concave portion 81 is not formed by the rib 811 . Therefore, the different parts will be described. The same reference numerals as in the first embodiment denote the same configurations as in the first embodiment, and refer to the previous description.

[0057] Such as Figure 10 As shown, the concave portion 81 of the second embodiment is formed by denting the facing surface 8 a of the first cover member 8 facing the first surface 2 a in a concave arc shape. The concave portion 81 is formed to face the respective pads 31 and 32 as in the first embodiment. The concave portion 81 forms gaps C1 , C2 between the electronic components A, B and the first cover member 8 . With this configuration, the same effects as those of the first embodiment are exhibited.

[0058] In addition, if Figure 11 As shown, also in the second embodiment, the upper ends of the elec...

no. 3 approach

[0060] The electronic circuit component of the third embodiment is mainly different from the first embodiment in that the electronic components A and B are also arranged on the second surface 2b (lower surface) side of the resin component 2 . Therefore, the different parts will be described. The same reference numerals as in the first embodiment denote the same configurations as in the first embodiment, and refer to the previous description.

[0061] Such as Figure 12 As shown, in the third embodiment, the pads 31 corresponding to the electronic component A are also formed on the second surface 2 b of the resin component 2 . The second surface 2 b is a surface on the opposite side to the first surface 2 a of the resin member 2 . In other words, electronic component A is arranged on both sides of lead frame 1 . The configuration of the pad 31 is the same as that on the first surface 2 a side, and a terminal portion (not shown) that can be connected to an electronic componen...

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PUM

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Abstract

An electronic circuit component is provided with: electronic components (A, B); a lead frame (1) that forms a circuit pattern corresponding to disposition of the electronic components (A, B); a resin member (2) in which a part of the lead frame (1) is disposed by means of insert molding; and a first cover member (8) that covers a first surface (2a) of the resin member (2) having the electronic components (A, B) disposed thereon. In the first surface (2a) of the resin member (2), recessed lands (31, 32) where the electronic components (A, B) are to be disposed are formed, at a bottom surface (Z) of the lands (31, 32), a plurality of terminal sections (40-57) are disposed, said terminal sections being parts of the lead frame (1) and being electrically connected to the electronic components (A, B), and in first cover member (8) areas facing the lands (31, 32), recessed sections (81) that form clearances (C1, C2) between the electronic components (A, B) and the first cover member (8) are formed.

Description

[0001] This application is based on Japanese Patent Application No. 2014-222839 filed on October 31, 2014, the entire content of which is incorporated herein. technical field [0002] The present disclosure relates to electronic circuit components. Background technique [0003] The electronic circuit is mainly composed of electronic components (electronic elements) such as capacitors, diodes, and ICs, and electronic circuit components provided with circuit patterns on which the electronic components are mounted. An electronic circuit component can also be said to be a substrate component on which a circuit pattern is formed with a conductor (for example, gold plating, lead material). Examples of electronic circuit components include printed circuit boards, pattern plating resins, and copper lead components. [0004] Pattern plating resin is described in Unexamined-Japanese-Patent No. 2003-204179, for example. Moreover, it describes in Unexamined-Japanese-Patent No. 2003-28...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/08H01L23/50
CPCH01L23/50H01L2924/0002H01L23/04H01L23/49541H01L23/49548H01L23/49575H01L23/49589H01L23/49861H01L2924/00H01L21/4803H01L21/565H01L23/057H01L23/13H01L23/49551H01L23/562H01L25/16
Inventor 吉田昌只
Owner DENSO CORP