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Method for resin hole plugging after patterning

A resin plug hole and pattern technology, applied in electrical components, printed circuits, printed circuit manufacturing, etc., can solve problems such as high cost and complex process control

Inactive Publication Date: 2017-09-08
SIHUI FUJI ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] These technical methods are carried out after electroplating, resin filling is performed with a squeegee, and grinding is required after plugging, the process control is complicated and the cost is high

Method used

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  • Method for resin hole plugging after patterning

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Embodiment Construction

[0024] For setting forth the concrete implementation method of the present invention, below in conjunction with accompanying drawing, the present invention is described in further detail:

[0025] A. The substrate that needs to be plugged after the graphics are prepared. The size of the substrate is 610mm*510mm, the thickness of the substrate is 1.6mm, the hole diameter that needs to be plugged is 0.45mm, the number of holes is 9846, the graphics area accounts for 56% of the substrate area, and the copper thickness is 51um. The transparent PET film to be torn off after the dry film is applied, the thickness of the film is 10um, and the size is 615mm*515mm.

[0026] B. Put the PET film on both sides of the board, apply alcohol rosin on the four corners of the substrate to have a slight adhesion with the PET film, put 5 pieces of kraft paper on each side for normal vacuum lamination, the pressure is 30kgf / cm2, and the temperature is 180°C. The lamination time is 30 minutes, and ...

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Abstract

The invention relates to a method for resin hole plugging after patterning. Implementation of the method comprises the steps of A, preparing a substrate requiring hole plugging after patterning, and preparing transparent PET films torn off after a dry film is mounted; B, mounting the PET films on two sides of a board respectively, and putting a piece of Kraft paper at the outer side to perform normal lamination, wherein the PET films are attached to a substrate after lamination; C, drilling a hole which is smaller than the aperture at each hole site requiring hole plugging by using a carbon dioxide laser drilling machine; D, performing vacuum lamination by using a prepreg, and carrying resin filling on laser drilled holes in the substrate; E, stripping the PET films and the cured prepreg together on the substrate; and F, performing resistance welding and the subsequent general production process. The method is simple to operate, reliable in quality, low in cost and short in production cycle.

Description

technical field [0001] The invention belongs to the technical field of circuit board production, and in particular relates to a method for plugging holes with resin after graphics. Background technique [0002] During the production process of the circuit board, if there is a requirement for via in pad, blind buried hole resin filling, or solder mask plug hole to be filled without air bubbles, the method of resin plug hole should be used. [0003] In the prior art, the resin plug holes of PCB boards are mainly operated in the following ways: drilling → copper plating → plug holes → post-curing → resin grinding (resin shoveling) → outer layer pattern transfer or next process. [0004] The common methods of resin grinding plate are: ceramic grinding plate, non-woven grinding plate, abrasive belt grinding plate, etc. [0005] In the prior art, most of the PCB boards are processed by the conventional resin plug hole manufacturing method, and the mechanical cutting method is use...

Claims

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Application Information

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IPC IPC(8): H05K3/00
CPCH05K3/0094H05K2201/0959
Inventor 黄明安刘天明曾令江
Owner SIHUI FUJI ELECTRONICS TECH
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