Distributed mode processor with three-dimensional memory array

A pattern processing and processor technology, applied in electrical digital data processing, character and pattern recognition, special data processing applications, etc., can solve problems such as large pattern libraries taking a long time

Active Publication Date: 2017-09-15
HANGZHOU HAICUN INFORMATION TECH
View PDF6 Cites 18 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, pattern processing for large pattern libraries takes a long time

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Distributed mode processor with three-dimensional memory array
  • Distributed mode processor with three-dimensional memory array
  • Distributed mode processor with three-dimensional memory array

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] figure 1 A distributed mode processor chip 200 is shown, which contains m x n storage processing units 100aa-100mn. These storage processing units 100aa-100mn are all formed on the substrate 0 . The input bus 110 is coupled to each storage processing unit, and the output bus 120 is coupled to each storage processing unit. Note that the distributed mode processor chip 200 may contain tens of thousands of storage processing units 100aa-100mn. Such a large number of storage processing units 100aa-100mn can ensure large-scale parallel computing to realize high-speed mode processing.

[0016] Each storage processing unit 100ij includes a pattern processing circuit 170 and at least one 3D-M array 180 storing at least one pattern. Figure 2A-Figure 2C is a circuit block diagram of three storage processing units 100ij. In these embodiments, one mode processing circuit 180 serves different numbers of 3D-M arrays 170 . Figure 2A The pattern processing circuit 180 in serves ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The present invention provides a distributed mode processor with a three-dimensional memory array. The distributed mode processor comprises multiple memory processing units, wherein each unit has a mode processing circuit and at least a 3D memory array that stores at least one mode. The 3D memory array is stacked above the mode processing circuit. By means of large-scale parallel computation, the distributed mode processor can perform rapid mode processing on large mode libraries.

Description

technical field [0001] This invention relates to the field of integrated circuits, and more specifically, to distributed mode processors. Background technique [0002] Pattern matching and pattern recognition refer to finding patterns that are the same as or close to the retrieval pattern (the pattern used for retrieval, search pattern) in the target pattern (retrieved pattern, target pattern). Among them, pattern matching requires finding the same pattern, and pattern recognition only requires finding close patterns. Unless otherwise specified, this specification does not distinguish between pattern matching and pattern recognition, and uses pattern processing to collectively refer to various operations on patterns. [0003] Pattern processing, including pattern matching and pattern recognition, has a wide range of applications. Common pattern processing includes string matching, code matching, speech recognition and image recognition, etc. String matching is widely used...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G06K9/00G06F17/30G06F21/56H04L29/06G10L15/34H01L27/112H01L27/115
CPCH01L27/105Y02D10/00
Inventor 张国飙
Owner HANGZHOU HAICUN INFORMATION TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap