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High modulus PBT composition with thermal and electrical conductivity and preparation method thereof

A composition and high-modulus technology, applied in the field of high-modulus PBT composition and its preparation, can solve the problems of very high stability control requirements and poor product comprehensive performance, and achieve excellent molding performance, good mechanical properties and High heat resistance, the effect of meeting technical requirements

Active Publication Date: 2019-03-19
无锡赢同新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As we all know, traditionally used thermal and conductive fillers need a large amount of addition to form an effective thermal and conductive network in the polymer matrix, resulting in very high requirements for stability control during the blending process and poor overall performance of the product.

Method used

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  • High modulus PBT composition with thermal and electrical conductivity and preparation method thereof
  • High modulus PBT composition with thermal and electrical conductivity and preparation method thereof

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Embodiment Construction

[0039] The invention provides a kind of high-modulus PBT composition with heat conduction and electric conduction function, which comprises following components: PBT resin (PBT-1 is Changchun Chemical Industry PBT-1100, and PBT-2 is Changchun Chemical Industry PBT-1200), graphite ( XR-100, Qingdao Yanhai), graphene microflakes (KNG-T181, Xiamen Kaina), stainless steel fiber (HT-CH75-T20, Hunan Huitong), metal tin (ST-M-011-5, Shanghai Shuitian ), glass fiber (ECS11-3.0-T436, Taishan), MBS (EXL-2690, Dow, USA), TPEE elastomer (Hytrel 4056, DuPont, USA), EMH (ethylene butyl acrylate maleic anhydride terpolymer, U.S. DuPont Fusabond A560), antioxidant-1 (Irganox 1010, BASF), antioxidant-2 (Irganox 168, BASF), floating fiber improver (LYSI-100A, Chengdu Silike) and release agent (Licolub WE 60TP, Clariant).

[0040] The present invention simultaneously provides a method for preparing the above-mentioned high-modulus PBT composition with thermal and electrical conduction functions...

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Abstract

The invention discloses high-modulus PBT (polybutylene terephthalate) composition with functions of heat conduction and electric conduction and a preparation method. The high-modulus PBT composition is prepared from PBT, electric conductive filler with thermal conductivity, a reinforcing agent and a flexibilizer, and is characterized in that the electric conductive filler with thermal conductivity comprises graphite, graphene nanoplatelets, metal fibers and metal powder, and the adding amount of the electric conductive filler with thermal conductivity is lower than 30% of the total weight of the composition. The electric conductive filler with thermal conductivity is formed by mixing graphite, the graphene nanoplatelets, the metal fibers and the metal powder, by means of compounding and a synergistic effect of the filler with different morphologies, effective electric conduction and heat conduction networks can be formed under the condition of lower filler consumption, technical requirements for electric conduction and heat conduction of the material can be met, and the material has good mechanical property, high heat resistance and excellent molding processability. The composition can be used for various applications related with heat conduction, electric conduction and electromagnetic shielding.

Description

technical field [0001] The invention belongs to the field of functional polymer materials, and in particular relates to a high-modulus PBT composition with heat conduction and conduction functions and a preparation method thereof. Background technique [0002] Polybutylene terephthalate (PBT) has the characteristics of excellent heat resistance, friction and wear resistance, chemical resistance, good dimensional stability, good molding processability, etc., and is widely used in electronic, electrical and automotive industries and household appliances. [0003] With the rapid development of modern information technology, the circuit density and load increase rapidly, the heat generated by the plastic products in the electronic components must be dissipated to the environment in time, otherwise the electronic components will be damaged due to excessive local temperature, and even Start a fire. Therefore, it is necessary to improve the thermal conductivity of plastics, and u...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L67/02C08K13/04C08K3/04C08K7/04C08K3/08C08K7/14
CPCC08K2201/001C08K2201/011C08K2201/014C08L67/02C08L2201/08C08L2205/025C08L2205/03C08L2205/035C08K13/04C08K3/04C08K7/04C08K3/08C08K7/14
Inventor 吴彤李莹
Owner 无锡赢同新材料科技有限公司