Device and semiconductor processing equipment for realizing impedance matching and power distribution

Abstract

The present invention provides an apparatus for implementing impedance matching and power distribution, and a semiconductor processing device. The apparatus comprises a power distribution circuit and an impedance matching circuit. An input end of the impedance matching circuit is used for being electrically connected to a radio frequency power supply. The power distribution circuit comprises at least two branches, and each branch comprises an upstream end and a downstream end. The upstream end of each branch is connected to an output end of the impedance matching circuit, and the downstream end of each branch is used for being connected to an external component. Each branch is serially connected to a power distribution unit, and the power distribution unit only comprises one first adjustable capacitor. The apparatus and the semiconductor processing device provided in the present invention have low costs, high integration and small volumes.

Description

technical field [0001] The invention belongs to the technical field of microelectronic processing, and in particular relates to a device for realizing impedance matching and power distribution and semiconductor processing equipment. Background technique [0002] Semiconductor equipment usually uses RF power as the plasma excitation source, such as physical vapor deposition equipment, chemical vapor deposition, etc. In order to transfer the power of the RF power to the chamber as completely as possible, it is necessary to connect the RF power and the reaction chamber in series. Connect the impedance matching device to match the input impedance and output impedance of the RF power supply. [0003] figure 1 It is a schematic diagram of the structure of a typical semiconductor device. see figure 1 , the top wall of the reaction chamber 100 is provided with an inner coil 12 and an outer coil 13 respectively corresponding to the central area and the edge area of ​​the reaction ...

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Problems solved by technology

[0005] Depend on figure 1 and figure 2 It can be seen directly that: figure 1 The current distribution circuit in the circuit is composed of a first inductor L1, a first adjustable capacitor C1, a first impedance R1 and a second impedance R2, which requires 4 components; figure 2 The current distribution circuit in the circuit is composed of the second inductance L2, the third impedance R3, the third inductance L3, the second adjustable capacitor C2 and the fourth impedance R4, which requires 5 components, that is to say, the existing current distribution The circuit usually requires 4 to 5 electronic devices (including adjustable capacitors, inductors, and impedances), and there are many components and high cost

In addition, since the current divider and the impedance matching device 10 are two independent parts, they are scattered and the integration degree is low.

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