wrap around lighting

Abstract

Provided is a surrounding type lighting device. The surrounding type lighting device comprises a supporting base, a mounting substrate, a surrounding heat-dissipation assembly and an LED light source module, and the mounting substrate is arranged on the supporting base; the surrounding heat-dissipation assembly comprises heat-dissipation supporting rods and a plurality of disassembling components, the heat-dissipation supporting rods are arranged on the side surface, far away from the supporting base, of the mounting substrate, and the disassembling components are arranged on the heat-dissipation supporting rods in a spaced mode correspondingly; and each disassembling component comprises a heat dissipation ring and two locking nuts, plug holes are formed in the heat dissipation rings, the heat-dissipation supporting rods penetrate through the plug holes in a sliding mode, the two locking nuts of each disassembling component are connected with the corresponding heat-dissipation supporting rod in a bolt joint mode and used for clamping the corresponding heat dissipation ring together. When being transported, the supporting base, the mounting substrate, each heat-dissipation supporting rod, each heat dissipation ring and each locking nut can serve as independent parts to be packed, and thus limitation aiming at packing operation is smaller; and when being used, the parts are assembled, a large heat dissipation area can further be achieved, and the heat dissipation performance is good.

Description

technical field [0001] The invention relates to the technical field of lighting, in particular to a surrounding lighting device. Background technique [0002] At present, a lamp refers to an appliance that can transmit light, distribute and change the light distribution of the light source, including all parts required to fix and protect the light source except the light source, as well as the necessary line accessories for connection to the power supply, and also need to install heat dissipation components to ensure proper cooling performance. [0003] However, in actual situations, in order to improve the heat dissipation performance of the heat dissipation component, especially in order to increase the heat dissipation surface area of ​​the heat dissipation component, usually, the heat dissipation component will be provided with sheet-shaped, prismatic, column-shaped or / and dot-shaped and other structures used to increase the heat dissipation surface area, although these...

AI Technical Summary

Problems solved by technology

[0003] However, in actual situations, in order to improve the heat dissipation performance of the heat dissipation component, especially in order to increase the heat dissipation surface area of ​​the heat dissipation component, usually, the heat dissipation component will be provided with sheet-shaped, prismatic, column-shaped or / and dot-shaped and other structures used to increase the heat dissipation surface area, although these structures can better improve the heat dissipation surface area of ​​the heat dissipation components, but due to these protruding structures, there are more discontinuous surfaces, that is, the overall surface is not smooth enough, and the , these protruding structures will generate large local stress on the packaging structure, which is easy to cause its own bending, and also easy to cause problems such as depressions in the corresponding areas of the packaging structure, and because the surface is not smooth enough, it will cost more packaging Material, that is to say, existing heat dissipation components due to the unevenness of the surface of the overall structure during packaging and transportation, thereby increasing the restrictions on packaging operations

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