Cutting device and cutting method
A technology for cutting devices and cutting lines, which is applied in the manufacture of electrical components, electric solid devices, semiconductor/solid devices, etc., and can solve problems such as shortened life of cutting jigs and increased operating costs of cutting devices
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Embodiment 1
[0048] refer to Figure 1A , Figure 1B , Figure 2A and Figure 2B Embodiment 1 of the cutting device of the present invention will be described. All the drawings in the application documents of the present invention are appropriately omitted or exaggerated and schematically drawn for the sake of easy understanding. The same reference numerals are attached to the same components, and explanations thereof are appropriately omitted.
[0049] Such as Figure 1A and Figure 1B As shown, the sealed substrate 1 includes a substrate 2 composed of a printed circuit board, a lead frame, etc., a plurality of chip-like components (not shown) installed in a plurality of regions (described later) of the substrate 2, and a And the sealing resin 3 formed to cover a plurality of areas. The sealed substrate 1 is a cut object that is cut into individual pieces at the end.
[0050] Such as Figure 1A As shown, a plurality of second marks 4A, 4B, . The second mark 4 is arbitrarily set ...
Embodiment 2
[0069] refer to Figure 3A and Figure 3B Embodiment 2 of the cutting device of the present invention will be described. Example 2 differs from Example 1 in that the alignment mark (first mark) of the cutting jig 9 is formed on the metal table 10 instead of the resin sheet 11 . Other configurations and operations are the same as those in Embodiment 1, and therefore descriptions thereof are omitted.
[0070] Such as Figure 3A As shown, a plurality of first marks are formed on the metal plate 10 in the longitudinal direction and the short side direction around the periphery of the resin sheet 11 so as to correspond to the positions of the second marks 4 provided on the sealed substrate 1. 18 (marked with + in the accompanying drawings). For example, with the 2nd marks 4A, 4B, ..., 4G, 4H (refer to Figure 1A ), the first marks 18A, 18B, . . . , 18G, 18H are formed at the four corners of the metal plate 10 . In addition, a desired number of first marks 18 may be formed alo...
Embodiment 3
[0074] refer to Figure 4 ~ Figure 6B Embodiment 3 of the cutting device of the present invention will be described. Such as Figure 4 As shown, the cutting device 19 is a device for forming a cut object into a plurality of products in one piece. The cutting device 19 has a substrate supply unit A, a substrate cutting unit B, and an inspection unit C as constituent elements, respectively. Each component (each module A to C) is detachable and replaceable with respect to another component, respectively.
[0075] The substrate supply unit A is provided with a substrate supply mechanism 20 for supplying the sealed substrate 1 corresponding to the cut object, a substrate loading unit 21 for delivering the sealed substrate 1 , and a substrate for conveying the sealed substrate 1 . The delivery mechanism 22. The conveyance mechanism 22 is movable in the X direction, the Y direction, and the Z direction, and is capable of turning in the θ direction. The sealed substrate 1 is tran...
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