A modular test support clamping device

Abstract

The invention relates to a module test supporting and clamping device, comprising a shell, eccentric rods and a cold plate, wherein an upper plate, a left side plate, a right side plate, a front baffle plate and a rear baffle plate are arranged on the shell; a first guide rail and a second guide rail form a slide way for placing a module, and the slide way is staggered with the front baffle plate; the eccentric rods are stepped straight shafts of which the axes are parallel but not superposed, and two ends of the eccentric rods respectively penetrate through the front baffle plate and the rear baffle plate; and the cold plate is located between the front baffle plate and the rear baffle plate and lapped onto the at least two eccentric rods. The module test supporting and clamping device can be used for installing a module conveniently without scratching the surface of the module, and flexibly adjusting installation and clamping of the module in a test bed to realize stepless adjustment, realizes tight contact between the cold plate and a heat dissipation surface, reduces the installation tolerance, and furthest reduces the scratch between the module and the guide rails during installation.

Description

technical field [0001] The invention relates to the field of test bench devices, in particular to a module test support and clamping device which is used to facilitate module disassembly and assembly and uses a cold plate to dissipate heat. Background technique [0002] The existing module test bench devices generally only provide basic support for the modules, and the heat dissipation requirements and clamping and fixing of the modules are generally realized separately. The heat dissipation design in some test devices cannot make the heat dissipation surface and cold plate flexible due to installation tolerances. If it is tightly attached, the heat dissipation effect cannot meet the requirements; some mounting clamping devices will cause damage to the surface of the module during the installation process. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a module test support and clamping device for convenient mod...

AI Technical Summary

Problems solved by technology

[0002] The existing module test bench devices generally only provide basic support for the modules, and the heat dissipation requirements and clamping and fixing of the modules are generally realized separately. The heat dissipation design in some test devices cannot make the heat dissipation surface and cold plate flexible due to installation tolerances. Closely attached, so that the heat dissipation effect cannot meet the requirements; some mounting clamping devices will cause damage to the surface of the module during the installation process

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