Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Wafer placement apparatus and wafer placement method

一种晶圆、引导装置的技术，应用在电气元件、电路、半导体/固态器件制造等方向，能够解决刮伤晶圆等问题，达到避免互相刮伤、避免相互刮伤的效果

Inactive Publication Date: 2017-10-31
SEMICON MFG INT (SHANGHAI) CORP +1
View PDF3 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the process of manually placing the wafer into the existing wafer placement device, it is easy to scratch the wafer

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wafer placement apparatus and wafer placement method
  • Wafer placement apparatus and wafer placement method
  • Wafer placement apparatus and wafer placement method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] As mentioned in the background art, during the process of manually placing a wafer into an existing wafer placement device, scratches on the wafer are prone to occur.

[0033] In one embodiment, wafer placement device, refer to figure 1 , comprising, a box body 100, the side walls of the box body 100 are provided with a plurality of pairs of slots, each pair of slots are located on the same layer opposite to each other, and the slots are suitable for fixing the wafer to be placed.

[0034] figure 1 The card slots include the first pair of card slots 101, the second pair of card slots 102 located on the first pair of card slots 101, the third pair of card slots 103 located on the second pair of card slots 102 and the third pair of card slots located on the third pair of card slots. The fourth pair of card slots 104 on the card slot 103 will be described as an example.

[0035] When the equipment in the manufacturing process breaks down or the wafer needs to be repaired...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a wafer placement apparatus and a wafer placement method. The wafer placement apparatus comprises a box body and a guiding apparatus; multiple groups of clamping grooves are formed in the side wall of the box body; the clamping grooves are suitable for fixing to-be-placed wafers; the clamping grooves have wafer input ends; the guiding apparatus comprises multiple groups of guiding grooves; the guiding grooves are suitable for being butt jointed at the wafer input ends; and the guiding grooves in each group and the butt jointed clamping grooves are positioned on the same layer. The wafer placement apparatus comprises the guiding apparatus, so that wafers can slide to the corresponding clamping grooves through the guiding grooves in the guiding apparatus, and scratching in a process of manually placing wafers to the wafer placement apparatus can be avoided.

Description

technical field [0001] The invention relates to the technical field of semiconductor equipment, in particular to a wafer placement device and a wafer placement method. Background technique [0002] In the semiconductor manufacturing process, wafers need to be transferred between various processes and different areas of the same process, and wafer placement devices (cassettes) are required for wafer transportation and storage. The use of the wafer placement device can provide an environment with a higher cleanliness for the wafer, and prevent the wafer from being polluted by pollution sources in the manufacturing environment with a lower cleanliness than the wafer placement device. [0003] In order to improve the utilization rate of the wafer placement device, usually a plurality of wafers are stored in a wafer placement device. The wafer placement device is provided with a plurality of slots, and the slots divide the wafer and play a supporting role, so that the bottom of ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/673
CPCH01L21/673H01L21/6732H01L21/67775H01L21/67781H01L21/6773H01L21/67763H01L21/6779H01L21/67778H01L21/67383
Inventor 年四军简子杰李小金董攀林
Owner SEMICON MFG INT (SHANGHAI) CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com