Modified phenolic resin adhesive

A technology for phenolic resin adhesives and adhesives, applied in adhesives, aldehyde/ketone condensation polymer adhesives, adhesive types, etc., can solve the problem of not being able to prevent the release of harmful substances such as formaldehyde, and achieve good results and strengthen physical and chemical properties. Properties and adhesive properties, the effect of eliminating formaldehyde

Active Publication Date: 2017-11-03
阜南县力韦包装材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But at the same time, there are many shortcomings in phenolic resin pressure. The biggest shortcoming is that formaldehyde will be released continuously in phenolic resin adhesive. The existing solution is to add modifiers, but it still cannot prevent the release of harmful substances such as formaldehyde.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] A modified phenolic resin adhesive. In the process of synthesizing the phenolic resin adhesive, soybean protein powder is added, and the ratio of formaldehyde, phenol, and soybean protein powder is: 1.2:1.0:0.8. The specific preparation method includes the following steps :

[0016] (1) First, bake soybean protein powder in an oven at 50°C to constant weight, spread it on a surface dish, put it in a microwave oven for irradiation, and process it for 2 minutes. After microwave treatment, stir and dilute with water until the water content is Put the 60% emulsion into an ultrasonic machine for ultrasonic treatment, keep the initial temperature at 30 ° C, ultrasonic for 40 minutes, wash with deionized water, and dry after suction filtration;

[0017] (2) Melt phenol, add it to the reaction kettle, stir for 20 minutes, add formic acid solution at 40°C, adjust the pH value of the system to 5.0, keep it at this temperature for 30 minutes, and continue to increase the temperatu...

Embodiment 2

[0022] A modified phenolic resin adhesive. In the process of synthesizing the phenolic resin adhesive, soybean protein powder is added, and the ratio of formaldehyde, phenol, and soybean protein powder is: 1.25:1.1:0.9. The specific preparation method includes the following steps :

[0023] (1) First bake soybean protein powder in an oven at 55°C to constant weight, spread it on a surface dish, put it in a microwave oven for irradiation, and process it for 2.5 minutes. After microwave treatment, stir and dilute with water until the water content is 62% of the emulsion, put it into an ultrasonic machine for ultrasonic treatment, keep the initial temperature at 35 ° C, ultrasonic for 43 minutes, wash with deionized water, and dry it after suction filtration;

[0024] (2) Melt phenol, add it to the reaction kettle, stir for 25 minutes, add formic acid solution at 42°C, adjust the pH value of the system to 5.1, keep it at this temperature for 35 minutes, and continue to increase t...

Embodiment 3

[0029] A modified phenolic resin adhesive. In the process of synthesizing the phenolic resin adhesive, soybean protein powder is added, and the ratio of formaldehyde, phenol, and soybean protein powder is: 1.3:1.2:1.0. The specific preparation method includes the following steps :

[0030] (1) First bake soybean protein powder in an oven at 60°C to constant weight, spread it on a surface dish, put it in a microwave oven for irradiation, and process it for 2-3 minutes. After microwave treatment, stir and dilute with water to contain The emulsion with a water content of 65% was placed in an ultrasonic instrument for ultrasonic treatment, and the initial temperature was kept at 40°C, ultrasonicated for 45 minutes, washed with deionized water, filtered and dried for later use;

[0031] (2) Melt phenol, add it to the reaction kettle, stir for 30 minutes, add formic acid solution at 45°C, adjust the pH value of the system to 5.2, keep it at this temperature for 40 minutes, and conti...

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PUM

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Abstract

The invention relates to the technical field of adhesives and discloses a modified phenolic resin adhesive. Active groups on side chains of soy protein molecules are fully utilized, the unbonded active groups form reticular crosslinking in a combination of phenolic resin, a closed effect on the hydrophilic gropes is achieved, and bonded formaldehyde in the system can be effectively absorbed; meanwhile, viscosity and bonding strength are improved; in preparation of the phenolic resin adhesive, natural ingredients with the functional groups are used to form the ester linkage groups in reaction, the formaldehyde is removed, physico-chemical property and bonding property of the adhesive are improved, release of the formaldehyde is smaller than 0.01mg/L, grade A in GB 18580-2001 is met, and good effect is achieved.

Description

technical field [0001] The invention belongs to the technical field of adhesive preparation, and in particular relates to a modified phenolic resin adhesive. Background technique [0002] Adhesive bonding (gluing, bonding, cementing, gluing) refers to the technology of connecting the surfaces of homogeneous or heterogeneous objects with adhesives, which has the characteristics of continuous stress distribution, light weight, or sealing, and low temperature in most processes. . Gluing is especially suitable for the connection of different materials, different thicknesses, ultra-thin specifications and complex components. Glue is developing the fastest in modern times and has a wide range of application industries. There are many classification methods of adhesives, which can be divided into thermosetting type, hot melt type, room temperature curing type, pressure sensitive type, etc. according to the application method; according to the application object, it can be divided...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J161/14C08G8/28
CPCC08G8/28C09J161/14
Inventor 王文朝
Owner 阜南县力韦包装材料有限公司
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