Unlock instant, AI-driven research and patent intelligence for your innovation.

Substrate integrated gap waveguide-based low-cost microstrip line package

A gap waveguide and substrate integration technology, applied in the electronic field, can solve problems such as no public reports, achieve good transmission performance, wide operating frequency band, and solve the effect of radiation loss and plane wave

Inactive Publication Date: 2017-11-03
YUNNAN UNIV
View PDF1 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Contents of the present invention, through literature search, do not see the public report identical with the present invention

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate integrated gap waveguide-based low-cost microstrip line package
  • Substrate integrated gap waveguide-based low-cost microstrip line package
  • Substrate integrated gap waveguide-based low-cost microstrip line package

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] The technical solution of the present invention will be further described in detail below in combination with specific embodiments.

[0035] Such as Figure 1-5 As shown, a low-cost microstrip line package based on substrate-integrated gap waveguide, including: a top dielectric board (1), a bottom dielectric board (2), where:

[0036] a. The upper surface of the top dielectric board (1) is printed with a metal layer, and periodic metal vias (3) are punched on the top dielectric board (1);

[0037] b. Periodic square metal patches (4) are printed on the upper surface of the bottom dielectric board (2), and the periodic square metal patches (4) are located directly below the periodic metal vias (3); the periodic metal vias ( 3) Together with the periodic square metal patch (4), it forms a mushroom-shaped electromagnetic bandgap (EBG) structure; the lower surface of the dielectric board (2) is printed with a metal layer; the transmission microstrip line (5) is printed on ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to substrate integrated gap waveguide-based low-cost microstrip line package. The package microstrip line structure is formed by pasting a top-layer dielectric plate (1) and a bottom-layer dielectric plate (2), wherein a metal layer is printed on an upper surface of the top-layer dielectric plate (1), periodic metal via holes (3) are formed in the dielectric plate (1), square metal patches (4) are printed on an upper surface of the bottom-layer dielectric plate (2), a microstrip line (5) is arranged at a middle position of the bottom-layer dielectric plate (2), and a grounding metal layer is printed on a lower surface of the bottom-layer dielectric plate (2). The low-cost dielectric plates are used for packaging the microstrip line, and the problem of cost of microstrip line package and the problems of radiation loss, a plane wave and cavity resonance existing in a traditional curved microstrip line are solved; and meanwhile, the microstrip line has the advantages of a simple structure, small size, wide bandwidth, low loss, structural stability and the like, and is easier to integrate, assemble and process.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a low-cost microstrip line package based on a substrate-integrated gap waveguide. Background technique [0002] Microstrip line is a kind of transmission line used to transmit microwave signals, and it has been widely used in many fields. Compared with metal waveguides, microstrip lines have the characteristics of small size, light weight, wide operating frequency band, high reliability and low manufacturing cost. However, traditional microstrip lines suffer from problems such as radiation loss, surface waves, and cavity resonances. [0003] The substrate integrated gap waveguide (Substrate Integrated Gap Waveguide, SIGW) can effectively suppress space radiation and surface waves. Since quasi-TEM waves are transmitted in the substrate-integrated gap waveguide (SIGW), when it is integrated with a microstrip line, there is no mode conversion loss. The substrate-integrated ga...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01P3/08
CPCH01P3/082
Inventor 申东娅董明张秀普袁洪任文平
Owner YUNNAN UNIV
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com