A fingerprint identification chip test device
A technology for fingerprint identification and chip testing, which is applied in the direction of electronic circuit testing, measuring electronics, measuring devices, etc., can solve the problems of low testing efficiency of fingerprint identification chips, and achieve the effect of improving testing efficiency
Pending Publication Date: 2017-11-07
CHINA KEY SYST & INTEGRATED CIRCUIT
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[0004] The purpose of the present invention is to overcome the shortcoming of low test efficiency of the current single-station fingerprint identification chip, and provide a multi-station fingerprint identification chip substrate testing device, which can perform multi-station testing on the fingerprint identification chip substrate
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[0031] The exemplary embodiments will be described in detail here, and examples thereof are shown in the accompanying drawings. When the following description refers to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementation manners described in the following exemplary embodiments do not represent all implementation manners consistent with the present invention. Rather, they are merely examples of devices and methods consistent with some aspects of the present invention as detailed in the appended claims.
[0032] In order to be able to test at least two fingerprint recognition chips at the same time, this application provides a fingerprint simulation component containing at least two fingerprint simulation heads and a probe module containing at least two sets of probes, which can be tested simultaneously Simulate at least two fingerprint information for identification by at least tw...
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The invention relates to a fingerprint identification chip test device belonging to the field of integrated circuit testing. The fingerprint identification chip test device comprises a carrying platform for carrying a chip substrate, a probe module and a fingerprint simulation component, wherein the fingerprint simulation component comprises at least two fingerprint simulation heads for simulating fingerprint information. The probe module comprises at least two groups of probes for connecting fingerprint identification chips and a testing machine. At least two fingerprint identification chips are laid on the chip substrate. The at least two fingerprint simulation heads of the fingerprint simulation component are in one-to-one corresponding contact with the same number of the fingerprint identification chips on the carrying platform. The at least two groups of probes of the probe module are in one-to-one corresponding contact with the upper portions of the same number of the fingerprint identification chips on the carrying platform. According to the invention, in a production process, a motor drives the fingerprint identification chip substrate to carry out testing in a mode of one column by one column, and multiples of fingerprint identification chips can be tested simultaneously, thereby substantially raising the efficiency of fingerprint identification chip testing.
Description
Technical field [0001] The invention belongs to the field of integrated circuit testing, and particularly relates to a fingerprint identification chip testing device. Background technique [0002] Fingerprint recognition chips are applied to various fields, such as mobile phones and card punching machines. In order to ensure the pass rate of the fingerprint identification chip, the fingerprint identification chip needs to be tested before it leaves the factory. [0003] The traditional fingerprint recognition chip test equipment can only test single station one by one. This kind of test equipment has low test efficiency and requires a lot of labor in production to ensure the output. Therefore, a multi-station fingerprint identification chip substrate test equipment is designed Improving the test efficiency of fingerprint recognition chips has become an urgent problem in the industry. Summary of the invention [0004] The purpose of the present invention is to overcome the low test...
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IPC IPC(8): G01R31/28
CPCG01R31/2894
Inventor 刘三利王露露张佳佳潘杰李文斌
Owner CHINA KEY SYST & INTEGRATED CIRCUIT