A High Voltage Fast Recovery Diode Structure
A recovery diode and diode technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as poor soft recovery performance and weak current turn-off capability, and achieve improved reverse recovery softness, good process compatibility, and improved The effect of area efficiency and chip withstand voltage
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Embodiment 1
[0034] In this embodiment, the high-voltage fast recovery diode, such as figure 2 As shown, the back local p+ doping region 12 is on the surface of the cathode, and the doping dose is 1×10 15 ~1×10 18 cm -2 , the width is 1-10 μm, the thickness is 1-10 μm, and the arrangement pitch is 1-10 μm. The high-voltage fast recovery diode terminals are all double-sided terminals, including a front terminal area 171 and a rear terminal area 172, respectively surrounding the anode area and the cathode area. The front terminal region 171 is arranged on the anode side of the diode, and includes one of field plates, field limiting rings, semi-insulating thin film layers, and junction terminal extension structures with laterally variable doping, or two or more of them. Combination; the back termination region 172 is arranged on the cathode side of the diode, including one of a field plate, a field limiting ring, a semi-insulating thin film layer, and a junction termination extension stru...
Embodiment 2
[0036] In this embodiment, the high-voltage fast recovery diode, such as image 3 As shown, the back local p+ doped region 12 is inside the cathode, and the doping dose is 1×10 15 ~1×10 18 cm -2 , the depth to the surface of the cathode region is 1-10 μm, the width is 1-10 μm, the thickness is 1-10 μm, and the arrangement pitch is 1-10 μm. The high-voltage fast recovery diode terminals are all double-sided terminals, including a front terminal area 171 and a rear terminal area 172, respectively surrounding the anode area and the cathode area. The front terminal region 171 is arranged on the anode side of the diode, and includes one of field plates, field limiting rings, semi-insulating thin film layers, and junction terminal extension structures with laterally variable doping, or two or more of them. Combination; the back termination region 172 is arranged on the cathode side of the diode, including one of a field plate, a field limiting ring, a semi-insulating thin film la...
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