41results about How to "Improve shutdown capability" patented technology

A reverse-conducting MOS device is provided having an active cell region and a termination region. Between a first and second main side. The active cell region comprises a plurality of MOS cells with a base layer of a second conductivity type. On the first main side a bar of the second conductivity type, which has a higher maximum doping concentration than the base layer, is arranged between the active cell region and the termination region, wherein the bar is electrically connected to the first main electrode. On the first main side in the termination region a variable-lateral-doping layer of the second conductivity type is arranged. A protection layer of the second conductivity type is arranged in the variable-lateral-doping layer, which protection layer has a higher maximum doping concentration than the maximum doping concentration of the variable-lateral-doping layer in a region attached to the protection layer.

The invention mainly relates to a rapid cutoff system of photovoltaic module and a restarting method after cutoff. The rapid cutoff system comprises a cutoff control module, a plurality of cutoff devices and a plurality of photovoltaic modules, wherein a plurality of photovoltaic modules are connected in series to form a battery pack, respective output voltages are superposed to obtain a DC bus voltage, and each cutoff device is used for removing the corresponding photovoltaic module from the battery pack so as to cut off or restoring from a cutoff state to a series connection state. When a cutoff command is received by the cutoff control module, a first instruction is send out to the plurality of cutoff devices so as to inform the plurality of cutoff devices to cut off the corresponding photovoltaic modules, or when a starting command is received by the cutoff control module, a second instruction is sent out to the plurality of cutoff devices so as to inform the plurality of cutoff devices to restore the corresponding photovoltaic modules from the cutoff states to the series connection states.

The invention provides a contact of a vacuum arc extinguishing chamber. The contact comprises a first contact and a second contact. The first contact is connected with a first conducting rod, and the second contact is connected with a second conducting rod. An arc ignition contact is arranged on and protrudes out of an end surface of the first contact. The arc ignition contact is connected inside the first conducting rod by a spring. An auxiliary contact is arranged on an end surface of the second contact and is used to cooperate with the arc ignition contact to generate an arc. The invention provides the contact reducing the breakdown field strength, controlling the arcing point, improving the interrupting capability of the vacuum arc extinguishing chamber, and having a low cost.

An accumulation layer controlled thyristor, which belongs to the technical field of semiconductor power devices, is characterized in that the on/off of the thyristor can be controlled by stopping electron circulation through an electron barrier of an internal electric field formed in a P bypass region and an N depletion region. When a positive voltage is applied on a gate, an accumulation layer is formed at the interface between the N depletion region (33) and a gate oxide layer (6); an electron inversion channel is formed in a P-type base region (8); and electrons pass through an N active region (9), the accumulation layer, an N layer (200), and the electron inversion channel to the an N base region (3), thereby controlling the normal operation of the device. The accumulation layer controlled thyristor as the substitute of the conventional gate controlled thyristors, such as MOS controlled thyristors, has the advantages of lower conduction voltage drop, larger saturation current density, no parasitic effect, and greatly improved safety operation area, and can overcome the disadvantages of the conventional gate-controlled thyristors, such as the deficiency of current saturation characteristic and poor turn-off capability.

The invention provides a gate drive circuit, an array substrate and a display device. Under the control of a signal inputted by an input terminal, a shift register transmits a clock signal of a first electrical level inputted by a second clock signal terminal to an output terminal in the first period of time, and transmits a clock signal of a second electrical level inputted by the second clock signal terminal to the output terminal in the second period of time. Under the control of a signal inputted by a first clock signal terminal, the shift register transmits a pull-down signal of the second electrical level to the output terminal in the second and third periods of time. Under the control of a signal inputted by a first reset terminal, the shift register stops transmitting the clock signal inputted by the second clock signal terminal to the output terminal in the third period of time. On this basis, the electric potential of a gate line can be pulled down together by the clock signal of the second electrical level and the pull-down signal of the second electrical level in the second period of time. Therefore, fast pulldown of the gate line is guaranteed and the power-off capability of a thin film transistor of a pixel unit and the charging capability of the pixel unit are further improved.

The invention relates to an IGBT apparatus provided with an internal JFET structure and belongs to the technical field of power semiconductor apparatuses. According to the IGBT apparatus structure, byintroducing a JEFT region in a body region of a conventional grate IGBT, the JFET region is equivalent to a variable resistor, a hole is stored when the apparatus is conducted forward and a quick releasing circuit is provided for the hole in forward blockage, so that the saturated conducting pressure drop and cut-off loss of the apparatus are reduced, the short-circuit failure phenomenon after the apparatus is cut off is avoided, and the cut-off ability of the apparatus is improved; moreover, a connecting bridge connecting the grate structure and the JFET region plays a field plate role whenthe apparatus is blocked forwardly, so that the electric field peak on the surface of the lower region of the connecting bridge is reduced effectively, and the voltage-resistant and operational reliability of the apparatus is improved. The IGBT apparatus provided with the internal JFET structure is compatible to an existing high voltage IGBT apparatus manufacturing process, so that industrialization is achieved favorably.

Power semiconductor device having a wafer, including emitter and collector electrodes arranged on opposite sides, wherein a gate electrode arranged on the emitter side has a conductive gate layer and an insulating layer arranged in the following order between the collector and emitter side: a p doped collector layer, an (n−) doped drift layer, an n doped enhancement layer, a p based base layer having a first and second base region, and an (n+) doped first and second emitter layer, wherein the emitter electrode contacts the first emitter layer and the first base region at an emitter contact area, wherein the second emitter layer is insulated from a direct contact to the emitter electrode by the insulating layer and wherein the second emitter layer is separated from the first emitter layer by the base layer.

The invention discloses a thin-film transistor; an active layer of the thin-film transistor is an indium-gallium-zinc oxide film, and a photosensitive active agent is doped into the indium-gallium-zinc oxide film. By adopting the photosensitive active agent, the turn-off performance of the thin-film transistor is improved, an off-state current (Ioff) of the thin-film transistor is reduced, and a specific value of an on-state current and the off-state current of the thin-film transistor is increased (Ion/Ioff), and the driving performance of the thin-film transistor is improved. The invention discloses a preparation method of the thin-film transistor, the preparation method comprises the following steps: preparing the active layer, dissolving the photosensitive active agent in a first preparation solution to form a precursor solution, distributing the precursor solution on a base and curing to form the indium-gallium-zinc oxide film containing the photosensitive active agent. Through the preparation method disclosed by the invention, the use of the photoresist can be avoided, the preparation process of the active layer is simplified, and the damage of the active layer caused by stripping the photoresist can be avoided.

The invention discloses a parallel IGBT driving method of power electronic equipment. The parallel IGBT driving method comprises the steps of configuring the driving number of parallel IGBTs, selecting a driving connection mode of the parallel IGBTs, setting IGBT gate voltage and driving resistance, and determining a graded turn-off mode of the IGBTs. According to the driving scheme, optical device isolation is not needed, non-delay synchronous driving of the parallel IGBT devices is guaranteed, and static and dynamic non-uniform currents are restrained; the single IGBT drive greatly improvesthe conduction and turn-off current capability of a single IGBT through gate voltage enhancement, drive resistor setting, hierarchical turn-off control and the like, reduces di/dt and overvoltage in the IGBT turn-off process, and guarantees the reliable operation of the IGBT. The IGBT drive circuit is simple in driving, flexible in control and quick in action, the IGBT parallel number can be flexibly configured according to a current target value, the capacity utilization rate of a single IGBT is high, and the IGBT drive circuit is suitable for large-current on-off valve group occasions of different voltage levels.

The invention discloses an IGBT (insulated gate bipolar transistor) device and a method for manufacturing the same. The method includes steps of 1, completely carrying out front surface processes on an IGBT device body and carrying out thinning operation on the back surface of the IGBT device body; 2, growing an epitaxial chemical compound layer on a back-surface bulk area of the IGBT device body; 3, growing silicon layers on the epitaxial chemical compound layer; 4, depositing a back-surface metal layer on the corresponding silicon layer and carrying out annealing; 5, sequentially depositing a nickel metal electrode layer, a titanium metal electrode layer and a silver metal electrode layer on the back-surface metal layer. The IGBT device and the method have the advantages that the epitaxial chemical compound layer grows on the back-surface bulk area of the IGBT device body to form heterogenous junctions, accordingly, withstand voltages of IGBT chips can be increased, and the thicknesses of the chips can be reduced; excess current carriers can be quickly combined with one another in turn-off procedures, and accordingly the turn-on and turn-off performance of the IGBT device can be improved.

The invention discloses an MOS transistor device. The MOS transistor device is provided with two gates, the first gate is a common gate arranged above a channel for controlling on and off of the device, and the second gate is a newly-added gate arranged above an LDD area for controlling drain-source on resistance Rdson. Through regulation by the second gate, on one hand, when the device is in a working state, the drain-source on resistance Rdson can be reduced, thereby reducing the working loss of the device and improving the on-off efficiency, and on the other hand, when the device is in an off state, drain-source capacitance Cds is reduced, the impedance between the drain and the source and the breakdown voltage BVdss are improved, and the separation ability when the device is off and the voltage swing blocking ability are thus improved.

The invention discloses a fully-controlled semiconductor device packaging structure based on integrated commutation. The fully-controlled semiconductor device packaging structure comprises a fully-controlled semiconductor device and a tube shell used for packaging the full-control type semiconductor device, the fully-controlled semiconductor device comprises a first chip assembly, a second chip assembly, a third chip assembly, a first transition layer, a second transition layer, a third transition layer and a fourth transition layer, the cathode terminal of the first chip assembly is connectedto the anode of the fully-controlled semiconductor device through the first transition layer; the anode terminal of the first chip assembly is connected to the cathode terminal of the second chip assembly through the second transition layer; the anode terminal of the second chip assembly is connected to the anode terminal of the third chip assembly through the third transition layer; the cathodeterminal of the third chip assembly is connected to the cathode of the fully-controlled semiconductor device through the fourth transition layer; and the first transition layer is connected with the third transition layer through a conductive plate.

Disclosed is an III-V group nitride power device. The III-V group nitride power device comprises an anode, a cathode and a substrate, and the III-V group nitride power device comprises an N-type gallium nitride drift region located above the substrate, and P-type-like regions and space charge windows are alternately arranged. The P-type-like regions are formed in the N-type gallium nitride drift region and located under the anode, electronegative ions are introduced into the P-type-like regions, the space charge windows are located between every two adjacent P-type-like regions, and a currentpath is provided between the anode and the cathode, wherein the P-like region and the space charge window are located in the N-type gallium nitride drift region or located on the surface of the III-Vgroup nitride power device. According to the structure, the forward conduction performance, the reverse breakdown performance and the reverse leakage current performance of the device can be considered at the same time, the feasibility of the technology for achieving the structure is high under the conditions of laboratories and industrial production, and the method is simple.

The invention relates to an RC-IGBT device integrated with a lateral freewheel diode by using a junction terminal and belongs to the technical field of semiconductors. The device comprises a gate contact region 1, an emitter contact region 2, a metal field plate 3, an N-type collector contact region 4, a P-type collector contact region 4', an emitter 5, a cellular region P-type well 6, a transition region P-type well 7, a first field limiting ring 8, a second field limiting ring 9, a third field limiting ring 10, an N-type collector 11, an N-type buffer layer 12, a P-type collector 13, an N-type drift region 14, a gate oxide layer 15 and a field oxide layer 16. On the premise of ensuring relatively low turn-off loss, reverse conduction performance and relatively high blocking voltage, a negative resistance effect existing when a traditional device is conducted can be eliminated, the working stability and the current conduction capability of the device are improved, and meanwhile, the manufacturing cost can be reduced.