Fully-controlled semiconductor device packaging structure based on integrated commutation

A technology of device packaging and packaging structure, which is applied in the direction of semiconductor devices, electrical components, pulse technology, etc., can solve the problems of extreme working performance and reliability of devices, cost burden and requirements of overall circuit breaker equipment, and achieve high integration , small size, and small stray parameters

Active Publication Date: 2020-12-01
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the current DC circuit breaker scheme, the power device is directly applied as a high-current breaking device, which not only has strict requirements on the ultimate performance and reliability of the device, but also brings a greater burden on the overall cost of the circuit breaker equipment.

Method used

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  • Fully-controlled semiconductor device packaging structure based on integrated commutation
  • Fully-controlled semiconductor device packaging structure based on integrated commutation
  • Fully-controlled semiconductor device packaging structure based on integrated commutation

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Embodiment Construction

[0032] The following will refer to the attached Figure 1 to Figure 4 Specific embodiments of the present disclosure are described in detail. Although specific embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided for more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0033] It should be noted that certain terms are used in the specification and claims to refer to specific components. Those skilled in the art should understand that they may use different terms to refer to the same component. The specification and claims do not use differences in nouns as a way of distinguishing components, but use differences in functions of components as a criterion for distinguishing. "Includes" or "compri...

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Abstract

The invention discloses a fully-controlled semiconductor device packaging structure based on integrated commutation. The fully-controlled semiconductor device packaging structure comprises a fully-controlled semiconductor device and a tube shell used for packaging the full-control type semiconductor device, the fully-controlled semiconductor device comprises a first chip assembly, a second chip assembly, a third chip assembly, a first transition layer, a second transition layer, a third transition layer and a fourth transition layer, the cathode terminal of the first chip assembly is connectedto the anode of the fully-controlled semiconductor device through the first transition layer; the anode terminal of the first chip assembly is connected to the cathode terminal of the second chip assembly through the second transition layer; the anode terminal of the second chip assembly is connected to the anode terminal of the third chip assembly through the third transition layer; the cathodeterminal of the third chip assembly is connected to the cathode of the fully-controlled semiconductor device through the fourth transition layer; and the first transition layer is connected with the third transition layer through a conductive plate.

Description

technical field [0001] The disclosure belongs to the technical field of electrical equipment, and in particular relates to a fully-controlled semiconductor device packaging structure based on integrated commutation. Background technique [0002] With the development of high-voltage direct current transmission and direct current grid technology, the research on power electronic devices for large-capacity system interruption applications has become more and more important. However, in the current development of high-power semiconductor power electronic devices, most of them are aimed at high-voltage and high-power industrial commutation applications. In the current DC circuit breaker scheme, the power device is directly applied as a high-current breaking device, which not only has strict requirements on the ultimate performance and reliability of the device, but also brings a greater burden on the overall cost of the circuit breaker equipment. . Contents of the invention ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03K17/292H03K17/735
CPCH03K17/292H03K17/735
Inventor 吴益飞吴翊荣命哲杨飞易强庄伟斌
Owner XI AN JIAOTONG UNIV
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