The present application relates to the field of
semiconductor device technology, and in particular to a
silicon carbide MOSFET device with integrated Schottky junction and a manufacturing method, wherein the device comprises: an N-type
silicon wafer; a groove located on the N-type
silicon wafer, wherein a P+ injection region is provided on one side of the bottom of the groove, and an
oxide layer and a deposited polysilicon layer are grown on the surface and sidewall of the groove; a split gate structure located above the
oxide layer and the deposited polysilicon layer, wherein the split gate structure comprises an Active Gate and a Dummy Gate, and the two sides of the split gate structure comprise a P-Well region and an N-Source region; and a
Contact region located above the P-Well region and the N-Source region. Thus, the problems in the related art that the
electric field at the bottom of the groove of the trench-type power SiC
MOSFET device is large, and it is easy to be broken down or injected into the interface state, or that the parasitic reverse
diode is a bipolar device, and when working in reverse, there is a large
diode reverse recovery current, resulting in large reverse losses, etc.