Reference adjustable programmable linear hall sensor chip

Abstract

The invention discloses a reference adjustable programmable linear hall sensor chip comprising a hall plate, a chopping amplifier, a reference voltage control circuit, an adjustable gain amplifier and a static output control circuit. The hall plate induces a magnetic field signal and converts the magnetic field signal into a hall voltage signal which enters the adjustable gain amplifier through detuning elimination by the chopping amplifier. The reference voltage of the chopping amplifier is controlled by the reference voltage control circuit, the gain of the adjustable gain amplifier is controlled by a gain adjusting circuit, and zero output of the static output control circuit is controlled and adjusted by a zero adjusting circuit. The advantages of the reference adjustable programmable linear hall sensor chip are that 1, internal reference output can be realized, and external reference input is allowed so that the static output voltage is enabled to follow the external reference voltage; 2, the consistency of the static output voltage can be realized so that the problem of different output voltage caused by manufacturing technology error can be solved; and 3, the size of the gain can be accurately controlled.

Description

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AI Technical Summary

Benefits of technology

This technology allows for precise control over both the power supply (voltage) level and temperature during operation without sacrificing accuracy or reliability due to variations from production quality standards. It achieves this with a single chip design that increases its overall performance compared to traditional methods such as analog techniques.

Problems solved by technology

This patented describes how current methods used in electronic systems involve measuring weakness or intensity (such as magnetism) from a device called a proximity detector. However, existing designs have limitations such as lack precision due to variations during production processes caused by imperfections on the surface of the wafer substrate being tested. Additionally, there may be issues where certain analog components can affect their performance if they were connected incorrectly.

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