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Base support component, film-forming device and method

A technology of film forming equipment and film forming method, which is applied in the direction of ion implantation plating, metal material coating process, coating, etc., can solve the problems of high risk, long tangent time, inflexible thickness adjustment, etc., and achieve non-hazardous , faster tangent speed and better working environment

Active Publication Date: 2017-11-21
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The present invention at least partly solves the problems of long tangent time, high risk, easy to cause sticking chips or fragments, and inflexible thickness adjustment in the existing technology of attaching copper tape to the cooling plate, and provides a base support assembly that can avoid the above disadvantages. Membrane Apparatus and Methods

Method used

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  • Base support component, film-forming device and method
  • Base support component, film-forming device and method
  • Base support component, film-forming device and method

Examples

Experimental program
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Effect test

Embodiment 1

[0043] Such as Figure 2 to Figure 4 As shown, the present embodiment provides a substrate support assembly, which includes a support plate 1 for supporting the substrate 5 in the film forming process, the support plate 1 has a working surface for facing the substrate 5, wherein,

[0044] There are a plurality of openings 11 arranged at intervals on the working surface of the support plate 1, and a movable block 2 and a driver 3 are arranged in each opening 11, and the driver 3 is used to drive the movable block 2 to lift relative to the working surface, so that the movement of the movable block 2 The top surface is at least movable between a position flush with the work surface and a position protruding from the work surface.

[0045] The substrate support assembly has a support plate 1, which is used to support a substrate 5 in a film forming process such as evaporation; and a mask plate 6 is a mask with a hollow pattern (not shown) for passing a film forming gas. The stenc...

Embodiment 2

[0080] Such as Figure 2 to Figure 4 As shown, the present embodiment provides a film-forming method, which is carried out by using the above-mentioned film-forming equipment, and the film-forming method includes:

[0081] The substrate 5 is supported outside the working surface of the support plate 1 of the substrate support assembly, and the mask plate 6 (such as a fine metal mask plate) with a hollow pattern (not shown in the figure) is set on the mask plate support assembly 69 , making it contact with the side of the substrate 5 away from the working surface;

[0082] According to the ups and downs of the mask 6, adjust the position of each movable block 2, so that each position of the base 5 is in contact with the mask 6;

[0083] The film forming component 7 is used to form a film on the position of the substrate 5 corresponding to the hollow pattern.

[0084] When using the above film forming equipment to form a film, the position of each movable block 2 can be adjust...

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Abstract

The invention provides a base support component, a film-forming device and a method and belongs to the technical field of film forming. The invention can at least partially solve the problems of long cutting time, high risk, easiness in causing sticky sheet or broken sheet and inflexible thickness adjustment of the present technique for paving a copper adhesive tape to a cooling plate. The base support component provided by the invention comprises a support plate which is used for supporting a base in a film-forming technique; the support plate has a working surface facing to the base; a plurality of openings are formed in the working surface of the support plate at intervals; a moveable block and a driver are arranged in each opening; the driver is used for driving the moveable block to ascend and descend relative to the working surface, so that the top surface of the moveable block can move between a position aligned with the working surface and a position protruded from the working surface.

Description

technical field [0001] The invention belongs to the technical field of film formation, and in particular relates to a substrate supporting component, film formation equipment and a method. Background technique [0002] Such as figure 1 As shown, in the evaporation equipment, the substrate 5 to be filmed can be arranged outside the working surface of the cooling plate 9 (due to the action of gravity, there is actually a gap between the substrate 5 and the working surface). The other side of the substrate 5 is in contact with a mask 6 (Mask) with a hollow pattern (not shown in the figure), and the evaporation gas generated by the evaporation source passes through the hollow pattern to form a film layer with a corresponding pattern on the substrate 5 . Since the mask plate 6 itself has wavy folds, some of its positions are not well bonded to the substrate 5 (there are gaps). Shape blending, edge blending, etc. To this end, the existing method is to stick copper tape 99 on th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/50C23C14/04C23C14/24
CPCC23C14/042C23C14/24C23C14/50
Inventor 孙朴吴文泽刘德健曹飞
Owner BOE TECH GRP CO LTD
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