Window type ball grid array packaging module

Abstract

The invention provides a window type ball grid array packaging module. The window type ball grid array packaging module comprises a substrate, an adhesive layer, a chip, a bonding wire, a plastic packaging body, and solder balls, wherein the substrate has opposite first surface and second surface, and a window which runs through the first surface and the second surface is formed in the substrate; the adhesive layer is formed on the second surface of the substrate; the chip is fixed on the second surface of the substrate through the adhesive layer; the bonding wire passes through the window and is electrically connected with the chip and the substrate; the plastic packaging body is formed on the second surface of the substrate and in the window to package the chip and the bonding wire; and the solder balls are implanted on the first surface of the substrate, wherein the contact surface on the edge of the adhesive layer covered with the plastic packaging body extends nonlinearly. By virtue of the window type ball grid array packaging module, the problem of cracking and damage of the chip in an injection molding process caused by stress concentration can be avoided, and particularly, the problem of cracking and damage of the chip caused by displacement can be avoided; and meanwhile, the adhesive region also can be enlarged, so that the chip can be better fixed.

Description

technical field [0001] The present invention relates to semiconductor storage components, in particular to a window ball grid array (Window Ball Grid Array, WBGA) packaging component. Background technique [0002] Among the package types of semiconductor devices, the window type ball grid array package structure is to open a through window for the substrate carrying the chip, so that the bonding wire can pass through the window and electrically connect the substrate and the chip. [0003] Such as figure 1 As shown, a known windowed BGA package assembly 100 includes a substrate 110 having a window 113 , an adhesive layer 120 , a chip 130 , bonding wires 140 , a plastic package 150 and solder balls 160 . Substrate 110 has opposite first surface 111 and second surface 112, and adhesive layer 120 comprises first adhesive surface 121 and second adhesive surface 122 on both sides of window 113, chip 130 is fixed on the substrate by adhesive layer 120 On the second surface 112 of...

AI Technical Summary

Problems solved by technology

When the chip is shifted due to inaccurate positioning or other reasons, the floating area may increase, such as Figure 4 As shown, the chip 130 will produce cracks at the edge of the adhesive layer 120 due to stress concentration, and the contact area between the chip 130 and the adhesive layer 120 will also become smaller, which will affect the fixing of the chip.

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