Laminated electronic component and manufacturing method thereof
A technology for electronic components and manufacturing methods, which is applied to parts, electrical components, and multilayer capacitors of fixed capacitors, etc., and can solve the problems of unbalanced sintering stress, complex material design, and difficulty.
Active Publication Date: 2020-12-25
SAMSUNG ELECTRO MECHANICS CO LTD
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But if it is to be fired, it is necessary to add special additives to the ceramics in the dielectric layer to match the sintering temperature between the dielectric layer and the internal electrode layer, and it is also necessary to add special additives to the internal electrode layer, so The material design is more complex, and there are limitations in process conditions such as cracks due to unbalanced sintering stress between the dielectric layer and the internal electrode layer
[0004] The following Patent Document 1 discloses a technology for arranging the upper and lower cladding layers to relieve the internal stress caused by the difference in partial shrinkage when the ceramic laminate is fired, but it cannot fundamentally solve the manufacturing problem. technical difficulties
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[0024] Hereinafter, embodiments of the present invention will be described with reference to the drawings and specific embodiments. However, the embodiments of the present invention can be modified into various forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the purpose of providing the embodiments of the present invention is to more completely explain the present invention to those who have average knowledge in the technical field to which the present invention belongs. Therefore, the shapes, sizes, and the like of elements in the drawings may be exaggerated for clarity, and elements denoted by the same reference numerals in the drawings are the same element.
[0025] In addition, in the drawings, in order to clearly explain the present invention, parts irrelevant to the description are omitted, and in order to clearly show a plurality of layers and regions, the thickness is exaggerated and shown, and the Componen...
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Abstract
The present invention relates to a laminated electronic component and its manufacturing method. The laminated electronic part includes: a composite main body including a laminated structure in which a plurality of internal electrodes are laminated with a composite layer including particles having dielectric properties and a resin; and external electrodes electrically connected to the A plurality of internal electrodes within a composite body; the particles having dielectric properties have grain boundaries distinguishable from adjacent particles.
Description
technical field [0001] The present invention relates to a laminated electronic component and its manufacturing method, in particular to a laminated ceramic capacitor and its manufacturing method. Background technique [0002] In general, a laminated ceramic capacitor among ceramic electronic components includes: a plurality of stacked dielectric layers; internal electrodes disposed facing each other with one dielectric layer in between; and external electrodes electrically connected to the internal electrodes. [0003] In addition, for the dielectric layer to develop proper dielectric properties, a high-temperature heat treatment process called "firing" is required. But if it is to be fired, it is necessary to add special additives to the ceramics in the dielectric layer to match the sintering temperature between the dielectric layer and the internal electrode layer, and it is also necessary to add special additives to the internal electrode layer, so The material design is...
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IPC IPC(8): H01G4/008H01G4/12H01G4/14H01G4/30
CPCH01G4/008H01G4/1209H01G4/1227H01G4/14H01G4/30H01G4/232
Inventor 金炳秀朴文秀崔才烈金旼撤
Owner SAMSUNG ELECTRO MECHANICS CO LTD