Circuit board with fine line, and manufacturing method for circuit board
A production method and thin circuit technology, applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., can solve problems such as easy generation of air bubbles, difficulty in filling solder resist ink, poor etching factor, etc., and achieve the effect of avoiding air bubbles
Active Publication Date: 2017-12-12
AVARY HLDG (SHENZHEN) CO LTD +2
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
The line width of the conventional printed circuit board production process is limited by the thickness of the copper layer. The thinner the copper layer, the thinner the lines, so there are limitations in using thick copper to make thin lines; and the conductive lines of conventional printed circuit boards are usually reduced. However, limited by the thickness of copper, only thin copper can be used to make thin lines, and after production, the etching factor is poor, and the etching is not clean to form burrs; the solder resist ink is difficult to fill, and it is easy to generate bubbles and other problems.
Method used
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[0028] The circuit board provided by the present invention and its manufacturing method will be further described in detail below with reference to the drawings and embodiments.
[0029] see Figure 1-7 , the first embodiment of the present invention provides a method for manufacturing a circuit board with thin lines, the steps of which include:
[0030] For a first step, see figure 1 , providing a support plate 10 on which a layer of peelable conductive film 12 is pasted. In this embodiment, the support plate 10 is a single-sided copper-clad substrate, the single-sided copper-clad substrate includes an insulating layer 14 and a copper foil layer 16 formed on the surface of the insulating layer 14, and the peelable conductive film 12 is attached to the The surface of the copper foil layer 14 .
[0031] Step Two: See figure 2 A layer of insulating substrate 20 is laminated on the surface of the peelable conductive film 12, and the thickness of the insulating substrate 20 r...
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The invention provides a manufacturing method for a circuit board unit with a fine line, and the method comprises the following steps: providing a supporting plate which is provided with a separable conductive film in a pasted manner; forming an insulating base material on the surface of the separable conductive film; forming a plurality of openings in the insulating base material, wherein the openings enable the separable conductive film to be exposed; and carrying out the electroplating at the positions of the openings and on the surface of the separable conductive film to form the fine line; removing the separable conductive film and the supporting plate, thereby obtaining the circuit board unit with the fine line. The invention also relates to a circuit board manufactured through the method.
Description
technical field [0001] The invention relates to the field of circuit board production, in particular to a circuit board with thin lines and a production method thereof. Background technique [0002] With the rapid development of electronic products, the printed circuit board as the support of components and the carrier of electrical signals should also gradually become miniaturized, lightweight, high-density and multi-functional, and then the production of fine lines of printed circuit boards put forward higher requirements. The line width of the conventional printed circuit board production process is limited by the thickness of the copper layer. The thinner the copper layer, the thinner the line, so the use of thick copper to make thin lines has its own limitations; and the conductive lines of conventional printed circuit boards are usually reduced. However, limited by the thickness of copper, only thin copper can be used to make thin lines, and after production, the etch...
Claims
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IPC IPC(8): H05K3/18H05K3/46
CPCH05K3/18H05K3/4611H05K2203/0723
Inventor 李卫祥李加龙张立仁洪匡圣
Owner AVARY HLDG (SHENZHEN) CO LTD