Copper plate polishing device

Abstract

The invention discloses a copper plate polishing device. The copper plate polishing device comprises a base. A vertical plate is fixed to one side of the base. Vertical rods are symmetrically fixed to the other side of the base. Sliding grooves are formed in the vertical rods. Sliding blocks are slidably connected into the sliding grooves. Springs A are fixed to the sliding blocks. Rolling wheels are rotationally connected between the two sliding blocks. Rolling wheels are rotationally connected between the parts, at the lower ends of the sliding grooves, of the vertical plate and the vertical rods. A fixed supporting rod is arranged between the vertical rods. A polishing wheel is rotationally connected between the vertical plate and the supporting rod. A transverse plate vertically fixed to the vertical plate is arranged above the supporting rod. A sliding rod is slidably connected to the transverse plate. A U-shaped plate is fixed to the lower end of the sliding rod. A polishing wheel is rotationally connected with the U-shaped plate. A transverse rod is fixed to the U-shaped plate. A spring telescopic rod is fixed to the transverse rod, and a clamping plate B is fixed to the lower end of the spring telescopic rod. A spring telescopic rod is fixed to the base, and a clamping plate A is fixed to the spring telescopic rod. A fixing plate is fixed beside a supporting rod. Two air blowers are fixed to the upper end and the lower end of the fixing plate. An arc-shaped groove is formed in the joint of the base and the vertical plate.

Description

technical field [0001] The invention relates to the field of copper product processing, in particular to a copper plate polishing device. Background technique [0002] Many copper products are processed from copper plates, and copper plates need to be polished and polished before processing. The polishing and grinding of copper plates is more complicated, and a large amount of debris will be generated during grinding. The existing polishing machines cannot have The function of collecting debris causes the debris to be scattered everywhere, polluting the environment, which is not good for the health of the operator, and the debris cannot be collected and used, which will also cause waste and loss. After polishing, the copper plate needs to be wiped manually, which is time-consuming, laborious and inefficient. Contents of the invention [0003] In order to solve the above existing problems, the present invention provides a copper plate polishing device. [0004] The present...

AI Technical Summary

Problems solved by technology

[0002] Many copper products are processed from copper plates, and copper plates need to be polished and polished before processing. The polishing and grinding of copper plates is more complicated, and a large amount of debris will be generated during grinding. The existing polishing machines cannot have The function of collecting debris causes the debris to be scattered everywhere, polluting the environment, which is not good for the health of the operator, and the debris cannot be collected and used, which will also cause waste and loss. After the polishing is completed, the copper plate needs to be manually wiped, which is time-consuming, laborious and inefficient.

Images