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Combined heat dissipation structure for led lamp

A heat dissipation structure and technology for LED lamps, applied in the field of heat dissipation components for lamps and heat dissipation structure components for LED lamps, can solve the problems of LED power wattage limitation, limited processing technology, and difficulty in meeting the production of one type and multiple uses, and achieves a device The effect of structure optimization, reduction of production cost and improvement of comprehensive heat dissipation effect

Active Publication Date: 2019-06-25
SHANGHAI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the existing technology, the size of the specific heat dissipation structure is often designed according to the wattage of the LED lamp, which results in the limitation of the LED power wattage applicable to the heat sink of a specific size.
And limited by the processing technology, the traditional LED heat dissipation structure is difficult to meet the production of one type and multiple purposes, which requires a simpler, lower cost, and practical LED light heat dissipation structure, which has become an urgent technical problem to be solved

Method used

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  • Combined heat dissipation structure for led lamp
  • Combined heat dissipation structure for led lamp
  • Combined heat dissipation structure for led lamp

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] In this example, see Figure 1~3, a combined heat dissipation structure for LED lamps, including a heat sink, a connecting piece 2 and a fixed top wire 3, the heat absorbing surface of the heat sink can be directly connected to the heat-generating end surface of the LED lamp, and the heat sink is connected by a series of heat sink modules 1 Combined to form a combined heat dissipation structure with a set overall shape, any two adjacent heat sink modules 1 are connected by connecting pieces 2 to form a combined heat dissipation structure connection unit, wherein each combination heat dissipation structure connection unit is formed by a front radiator The module 11 and the rear-end radiator module 12 are connected by the connecting piece 2, and the connected radiator module 1 and the connecting piece 2 are fastened and connected by the fixed top wire 3. The radiator module 1 has a lower heat-absorbing surface , the upper heat dissipation surface, the left connection part...

Embodiment 2

[0038] This embodiment is basically the same as Embodiment 1, especially in that:

[0039] In this example, see Figure 4 and Figure 5 , fasten the cylindrical joint 201 of the connecting sheet 2 with the outer cylindrical bayonet 102 of the radiator module 1, and connect the connecting sheet 2 and the radiator module 1 in sequence to form a connection between the connecting sheet 2 and the radiator module 1 The hinge connection combination with a common rotation axis forms a curved combined heat dissipation structure, so that the lower heat absorption surface composed of the heat dissipation body modules 1 forms a heat dissipation curved surface. When the cylindrical joint 201 is fastened with the outer circular bayonet 102, a hinge with a common axis of rotation can be formed. Therefore, other radiator modules 1 that are plugged into the connecting piece 2 can form a hinge connection with the radiator module 1 through the connecting piece 2 that can be selected around a c...

Embodiment 3

[0044] This embodiment is basically the same as the previous embodiment, and the special features are:

[0045] In this embodiment, the connecting piece 2 is as wide as the heat sink module 1. When the connecting piece 2 is combined with the heat sink module 1, the connecting piece 2 on the front and rear sides of the heat sink module 1 is inserted into the mounting surface with the same width. The end faces of the heat sink module 1 are even, and a series of combined heat sink structures are combined side by side to form a combined heat sink with an expanded surface structure. In this embodiment, according to the specific structure and heat dissipation requirements of the lamp, multiple heat dissipation structures can be flexibly combined to meet the requirements of one type of multi-purpose heat dissipation structure, thereby reducing the production cost.

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Abstract

The invention discloses a combined heat dissipation structure for an LED lamp. The combined heat dissipation structure comprises a heat dissipation body, a connection sheet and fastening screws. Linear and annular heat dissipation sheet connection modes can be formed by buckling inner and outer round bayonets of the heat dissipation body with connectors of the connection sheet, and different numbers of combined heat dissipation structures can be adopted as required to form heat dissipation combination structures with different sizes so that the actual requirements for lamp structures and heat dissipation can be met. The combined heat dissipation structure is easy to combine and good in heat dissipation effect, by flexibly combining the multiple heat dissipation structures, the effect that the heat dissipation structure for the LED lamp meets the requirements of various LED lamps can be well achieved, accordingly, the production cost is reduced, and resources are effectively saved.

Description

technical field [0001] The invention relates to a heat dissipation assembly for a lamp, in particular to a heat dissipation structure assembly for an LED lamp, which is applied in the technical field of LED lighting equipment. Background technique [0002] At present, driven by people's two major demands for energy saving and environmental protection, the fourth-generation lighting source LED has gradually replaced traditional lighting sources in the lighting field due to its advantages such as long life, energy saving and environmental protection, and high electro-optic conversion efficiency. Large-scale promotion and wide application have become possible. [0003] As a direct electroluminescent light source, LED chips are restricted by quantum efficiency, and will generate a lot of heat energy due to lattice oscillations generated by non-radiative recombination. Moreover, in order to achieve higher light intensity, the high integration density of LED chips leads to a rapi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21V17/14F21V29/503F21V29/76F21Y115/10
CPCF21V17/14F21V29/503F21V29/76F21Y2115/10
Inventor 吕北轩熊峰
Owner SHANGHAI UNIV