A high-temperature aging test device for integrated circuits

Abstract

The invention discloses a high-temperature aging testing device for an integrated circuit board, and the device comprises a circuit system and a supporting mechanism. A high-temperature-resistant PCB is employed as a carrier of a transmission line led into a high-temperature box, and the device is provided with a multi-stage interface board, and employs a programmable logic device to output an input test signal to a plurality of connectors where to-be-tested module groups are inserted, thereby achieving the batch testing. The interior of the high-temperature box is provided with an adjustable supporting mechanism and a locking device, and is compatible with adapter boards in different sizes. The distance between the adapter boards can be adjusted, so as to adapt to the to-be-tested module groups in different sizes. The adapter boards remain horizontal under the action of the supporting mechanism, and are provided with dedicated power supply circuits, so as to meet the demands of large-current power supply and solve a problem that a connector cannot transmit a large current. Modules which directly make contact with the circuit board are insulating materials, thereby preventing the charge on the high-temperature box body from be transmitted to a module group so as to avoid the impact on the operation of the module group. The device is simple in structure, is convenient to use, is low in cost, and is high in stability.

Description

technical field [0001] The invention relates to a test device for an integrated circuit chip, in particular to a high-temperature aging test device for an integrated circuit. Background technique [0002] In recent years, with the increasing consumer demand and the strong support of governments at all levels, the development of the integrated circuit industry has advanced by leaps and bounds. However, due to the late start and little accumulation, it is easy to have stability problems in the mass production of integrated circuit chips, and the instability of any chip in the finished product circuit board will eventually affect the performance of the entire product. Therefore, it is necessary to carry out strict inspection and screening of integrated circuit chips, and to test the sustainable working life of chips through necessary aging methods. [0003] Chip aging generally requires batch selection of chips, building a test circuit, placing them in a high-temperature box, ...

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Problems solved by technology

However, such a high-temperature box and backplane are expensive, and during the test process, there is a certain probability that the module will not work properly due to loose connectors. Therefore, when an abnormality occurs, it is difficult to determine whether it is caused by poor connection or the chip itself. Another method is to introduce the test signals into the high-temperature box one by one through the connecting line. When the number of tested modules is small, it can be operated. There are large parasitic capacitance and parasitic inductance on the connection line, and it is difficult to quantify, which will have a serious impact on the transmission and delay of the test signal

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