Dressing disk system, chemical mechanical polishing device and method for detecting falling off of dressing disk

A technology of chemical machinery and grinding devices, which is applied in the direction of abrasive surface adjustment devices, grinding/polishing equipment, and grinding machine parts, etc. It can solve the problem that the trimming disc falls off and cannot be detected, and achieves intuitive test signals and simple implementation methods Effect

Active Publication Date: 2019-07-12
淮安西德工业设计有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a trimming disc system, a chemical mechanical polishing device and a trimming disc shedding detection method, which are used to solve the problem that the trimming disc cannot be detected when grinding in the prior art. Waiting question

Method used

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  • Dressing disk system, chemical mechanical polishing device and method for detecting falling off of dressing disk
  • Dressing disk system, chemical mechanical polishing device and method for detecting falling off of dressing disk
  • Dressing disk system, chemical mechanical polishing device and method for detecting falling off of dressing disk

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Embodiment 1

[0063] like Figure 1~5 As shown, the present invention provides a dressing disc system that can detect the dressing disc falling off during the grinding process, including:

[0064] Dressing disc 11, used for dressing the grinding pad during the grinding process;

[0065] a fixed disk 21, located above the trimming disk 11, and fixed to the trimming disk 11; and

[0066] The detection system includes an insulating part 31 and a sensor assembly 32. The insulating part 31 is arranged in the fixed plate 21 and has a first surface 311 and a second surface 312 opposite to each other. The first surface 311 and the trimming The discs 11 are in contact, the sensor assembly 32 is disposed on the second surface 312 , and the detection system is used to detect the falling off of the trimming disc 11 .

[0067] Specifically, the present invention improves the original system on the basis of the original trimming disc system by improving the trimming disc system to add a detection syste...

Embodiment 2

[0085] like Figure 5 As shown, the present invention also provides a chemical mechanical polishing device, comprising:

[0086] Grinding table 61;

[0087] A grinding pad 71, located on the upper surface of the grinding table 61;

[0088] The polishing head 81 is located on the upper surface of the polishing pad 71, and is used to chemically mechanically polish the wafer 9 to be polished between the polishing head 81 and the polishing pad 71; and

[0089] The trimming disc system is located on the upper surface of the grinding pad 71, and the trimming disc system is the trimming disc system that can detect the trimming disc falling off during the grinding process as described in any one of the first embodiment.

[0090] Specifically, this embodiment provides a chemical mechanical polishing device for a wafer, including the trimming disc system described in any one of the embodiments. In the process of carrying out chemical mechanical polishing to the wafer, the polishing p...

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Abstract

The invention provides a trimming plate system, a chemical mechanical grinding device and a trimming plate fall-off detection method. The trimming plate system comprises a trimming plate, a fixing plate and a detection system, wherein the trimming plate is used for trimming a grinding pad in the grinding process; the fixing plate is located above the trimming plate and fixed to the trimming plate;the detection system comprises an insulation part and a sensor assembly; the insulation part is arranged in the fixing plate and provided with a first surface and a second surface which are opposite;the first surface makes contact with the trimming plate; the sensor assembly is arranged on the second surface; and the detection system is used for detecting fall-off conditions of the trimming plate. Through the scheme, according to the trimming plate system, by detecting the fall-off conditions of the trimming plate in the grinding process through the detection system, detection is conducted in real time, and fall-off of the trimming plate is found in time; and a capacitance-type sensor can be adopted by the detection method, testing signals are visual, and the mode is simple and convenient.

Description

technical field [0001] The invention belongs to the field of equipment and manufacturing technology, and in particular relates to a trimming disc system capable of detecting the shedding of the trimming disc during the grinding process, a chemical mechanical grinding device and a trimming disc shedding detection method. Background technique [0002] In the semiconductor process flow, chemical mechanical polishing (CMP) is a very important process, sometimes also called chemical mechanical planarization. The so-called chemical mechanical polishing is a process that uses chemical and mechanical combined action to remove excess material from semiconductor silicon wafers and obtain a flat surface. [0003] The main equipment of chemical mechanical polishing generally includes: polishing pad dressing disc, polishing table, polishing pad (Pad), polishing liquid supplier, and polishing head. The grinding pad is arranged on the grinding table; the lower end of the grinding head is ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B53/017
Inventor 王海宽林宗贤吴龙江郭松辉吕新强
Owner 淮安西德工业设计有限公司
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