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Chip defect recognition method based on convolutional neural network

A convolutional neural network and chip defect technology, applied in the field of chip defect identification based on convolutional neural network, to achieve the effect of positioning, avoiding manual intervention, and improving the accuracy of identification

Inactive Publication Date: 2018-01-09
HUAZHONG UNIV OF SCI & TECH
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Problems solved by technology

[0003] Aiming at the above defects or improvement needs of the prior art, the present invention proposes a chip defect recognition method based on a convolutional neural network. This method does not need to perform complex preprocessing on the image, and directly inputs the gray value information of the chip image into the volume In the convolutional neural network model, the convolutional neural network is used to extract image features layer by layer to realize the identification of chip defects. The convolutional neural network model constructed by the present invention has strong robustness. Through the study of the data set, it can continuously Improve the accuracy and speed of recognition, with the advantages of high recognition accuracy and fast speed, and can be used to identify unqualified chips with apparent defects in the chip manufacturing process

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  • Chip defect recognition method based on convolutional neural network

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[0027] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not constitute a conflict with each other.

[0028] Such as figure 1 As shown, an embodiment of the present invention provides a chip defect recognition method based on a convolutional neural network, which includes the following steps:

[0029] (1) Build a data set: collect images of each type of chip according to the preset classification category, and normalize the size of these images to build a data set, wherein the number of collect...

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Abstract

The invention belongs to the field of image processing, and specifically discloses a chip defect recognition method based on a convolutional neural network (CNN). The method comprises the following steps of: acquiring respective types of chip images according to preset classification types, and performing size normalization to construct a data set; constructing a CNN initial model including an input layer, a convolution layer, a downsampling layer, a full connection layer and an output layer; randomly extracting images from the constructed data set to construct a training set, and inputting the images in the training set into the constructed CNN initial model for training to obtain a CNN final model; acquiring a chip image to be recognized as the input layer to be directly input into the final CNN final model, and completing the image feature extraction by successively passing the chip image through the convolution layer, the downsampling layer and the full connection layer, and enabling the output layer to output a recognition result so as to complete online chip defect recognition. The method can realize the rapid recognition of chip defects, has high recognition accuracy and high speed.

Description

technical field [0001] The invention belongs to the field of image processing, and more specifically relates to a chip defect recognition method based on a convolutional neural network. Background technique [0002] Chip defect detection is crucial to controlling the quality of chip products. The currently used chip defect recognition method adopts the method of "image preprocessing-target segmentation-feature extraction-defect recognition and classification". This recognition method has no learning ability, takes a long time to identify, and relies heavily on models. The feature extraction and description are complicated and cumbersome, requiring a lot of professional knowledge of the operator, requiring high experience of the operator, and not being adaptable to the environment. Therefore, the traditional chip defect recognition method can no longer meet the requirements of defect recognition rate and recognition speed in the modern chip manufacturing field, and research ...

Claims

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Application Information

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IPC IPC(8): G06T7/00G06T7/11G06T7/136
Inventor 林惠李斌王兴刚舒雨锋牛拴龙王博马一鸣王松
Owner HUAZHONG UNIV OF SCI & TECH
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