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Encapsulation substrate, OLED display panel and encapsulation method thereof

A technology for packaging substrates and display panels, which is applied in the manufacture of electrical components, electric solid-state devices, semiconductor/solid-state devices, etc., can solve the problems of uneven distribution and uncontrollable fluidity of packaging glue, and achieves improved uniformity and fluidity. , the effect of controllable flow direction

Active Publication Date: 2018-01-09
BOE TECH GRP CO LTD
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Problems solved by technology

[0005] Aiming at the above-mentioned deficiencies in the prior art, the present invention provides a packaging substrate, an OLED display panel and a packaging method thereof, which are used to at least partially solve the problem of uncontrollable fluidity and uneven distribution of the packaging glue during the packaging process of the OLED display panel. question

Method used

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  • Encapsulation substrate, OLED display panel and encapsulation method thereof
  • Encapsulation substrate, OLED display panel and encapsulation method thereof
  • Encapsulation substrate, OLED display panel and encapsulation method thereof

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Embodiment Construction

[0034] The technical solutions in the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the present invention. Apparently, the described embodiments are part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0035] combine figure 2 with Figure 5 As shown, the present invention provides a packaging substrate 1, the packaging substrate 1 includes a base substrate 11, and also includes a plurality of first spacers 12 disposed on the base substrate 11, and each first spacer 12 is formed for The guiding channel 13 of the packaging glue 2 is guided, and the packaging glue 2 can diffuse along the guiding channel 13 . Figure 5 The direction indicated by the middle arrow is the flow and diffusion ...

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Abstract

The invention provides an encapsulation substrate, an OLED display panel and an encapsulation method thereof. A guiding channel for guiding the encapsulation glue is formed by the first insulation pads after arranging multiple first insulation pads on the encapsulation substrate; the encapsulation glue can diffuse along the guiding channel in the encapsulation process of the encapsulation substrate and the paired box substrate, so that the encapsulation glue can diffuse according to a preset direction and path. The flowing direction of the encapsulation glue is controllable, the fluidity of the encapsulation glue is improved to some extent, and the uniformity of the encapsulation glue filing is improved.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a package substrate, an OLED display panel and a package method thereof. Background technique [0002] OLED (Organic Light-Emitting Diode, Organic Light-Emitting Diode) devices have become a very Competitiveness and prospects for next-generation display technologies. The organic light-emitting materials and cathode materials used in OLED devices are particularly sensitive to water and oxygen. Too much humidity or too high oxygen content will affect the service life of OLED devices. In order to effectively block the influence of water and oxygen on OLED devices, it needs to be encapsulated, such as Figure 1a As shown, the encapsulation glue 2 is dropped between the array substrate 3 and the encapsulation substrate 1 to block water and oxygen in the air, and the array substrate 3 and the encapsulation substrate 1 are bonded and fixed with the encapsulation glue to achieve sealin...

Claims

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Application Information

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IPC IPC(8): H01L51/52H01L51/56H01L27/32
Inventor 孙宏达林俊仪宋泳锡李伟张建业
Owner BOE TECH GRP CO LTD
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