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Driving chip, display substrate, display device and manufacturing method of display device

A technology for driving chips and display substrates, applied in static indicators, optics, instruments, etc., which can solve problems such as deformation of flexible display panels, product breaks or short circuits, and broken metal wiring, to achieve improved product yield, low cost, and resolution high rate effect

Pending Publication Date: 2018-01-23
BOE TECH GRP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the hardness of the driving chip is relatively high. When it is crimped and bonded with the flexible display panel, it will easily cause the connection bump (bump) on the driving chip to sink and the flexible display panel to be deformed due to the influence of the large binding pressure. Breaks the metal wiring connected to the connection pad on the flexible display panel, resulting in undesirable defects such as open circuit or short circuit in the product

Method used

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  • Driving chip, display substrate, display device and manufacturing method of display device
  • Driving chip, display substrate, display device and manufacturing method of display device
  • Driving chip, display substrate, display device and manufacturing method of display device

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Embodiment Construction

[0037] In order to illustrate the present invention more clearly, the present invention will be further described below in conjunction with preferred embodiments and accompanying drawings. Similar parts in the drawings are denoted by the same reference numerals, and the various parts are not drawn to scale. Those skilled in the art should understand that the content specifically described below is illustrative rather than restrictive, and should not limit the protection scope of the present invention.

[0038] Those skilled in the art can understand that the driver chip includes an input area and an output area that are usually disposed adjacent to the edge of the chip, the input area includes a plurality of input bumps, and the output area includes a plurality of output bumps. In the present invention, the term "connection bump" refers to an input bump or an output bump in the input area or output area of ​​the driver chip that is used to electrically connect to the connectio...

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Abstract

The invention discloses a driving chip, a display substrate, a display device and a manufacturing method of the display device. The driving chip comprises a substrate and multiple connecting convex blocks and multiple supporting convex blocks which are arranged on the substrate, the multiple connecting convex blocks comprise at least one group of the connecting convex blocks arranged in the firstdirection, the multiple supporting convex blocks comprise supporting convex blocks located between the adjacent connecting convex blocks arranged in the first direction. By means of the supporting convex blocks, the probability of the problems that when the display device is manufactured, signal lines are broken and are bad is effectively lowered, and the finished product yield is increased.

Description

technical field [0001] The invention relates to the field of display driving. More specifically, it relates to a driving chip, a display substrate, a display device and a manufacturing method of the display device. Background technique [0002] Flexible substrates are more and more widely used in display devices because of their thinness and good impact resistance. When manufacturing such a display device, the flexible substrate is generally fixed on the glass substrate first, and then the subsequent flexible display panel manufacturing process is performed. Such a process is compatible with existing LCD devices. After the flexible display panel is manufactured, the flexible substrate is separated from the glass substrate, and a film (back film) is attached to the back of the flexible substrate to flatten the flexible substrate, and then chip-on-film (COF) bonding (bonding) and other processes are carried out to realize the drive. A chip (driving chip, also called a driver...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/133G02F1/1345
CPCH01L2224/14155H01L2224/13005H01L2224/14152H01L2224/14154H01L24/13H01L2224/13013H01L2224/14051H01L2224/81201H01L24/17H01L24/14H01L24/16H01L24/81H01L2224/81203H01L2224/17517H01L2224/16227H01L27/1262H01L27/1218H01L2224/13144H01L2924/00014H01L2924/206H01L27/1244H01L2224/10125H01L2924/1426H01L2224/14515H10K59/12
Inventor 陈立强蔡宝鸣李建伟卜德军杜双郑灿
Owner BOE TECH GRP CO LTD
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