Light-emitting diode flip chip grain and displayer

A technology of light-emitting diodes and crystals, which is applied in semiconductor devices, electrical solid-state devices, electrical components, etc., can solve the problems of light-emitting diodes with wavelength shift, high luminous power, and influence on the light-emitting effect of light-emitting diodes, so as to improve the light-emitting quality, Improve heat dissipation and avoid light wavelength shift

Inactive Publication Date: 2018-02-13
ZHANJING TECH SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The luminous power of the flip-chip LED is high, and the heat generated when emitting light is also large. If the heat dissipation is not good, the wavelength of the light generated by the LED will shift, which will affect the luminous effect of the LED.

Method used

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  • Light-emitting diode flip chip grain and displayer
  • Light-emitting diode flip chip grain and displayer
  • Light-emitting diode flip chip grain and displayer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] Please refer to figure 1 A preferred embodiment of the present invention provides a flip-chip die 100 for a light emitting diode, which includes a flip-chip die 10 and a heat dissipation and light-absorbing layer 20 bonded to the side of the flip-chip die 10 . The heat dissipation and light absorbing layer 20 is used to absorb the light emitted from the side of the flip-chip die 10 and dissipate the heat generated by the flip-chip die 10 .

[0016] The heat-dissipating and light-absorbing layer 20 is made of graphite, diamond-like carbon, silica gel, and other materials that have both light-absorbing and heat-dissipating functions. The heat-dissipating and light-absorbing layer 20 can avoid the wavelength shift of the light emitted by the flip-chip die 10 due to poor heat dissipation, thereby improving the luminous quality of the flip-chip die 100 of the LED. The heat dissipation light-absorbing layer 20 is coated on the side of the flip-chip die 10 by glue coating tec...

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PUM

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Abstract

The invention relates to a light-emitting diode flip chip grain. The light-emitting diode flip chip grain comprises a flip chip grain and a heat dissipating and light absorbing layer combined to the side face of the flip chip grain, the heat dissipating and light absorbing layer is capable of absorbing light outgoing from the side face of the flip chip grain and dissipating heat generated by the flip chip grain, in this way, heat dissipation of the flip chip grain can be improved, light wavelength shift, caused by poor heat dissipation, of the flip chip grain is avoided, and the light emittingquality of the light-emitting diode flip chip grain is improved. The invention further provides a displayer using the light-emitting diode flip chip grain.

Description

technical field [0001] The invention relates to a light-emitting diode flip-chip grain and a display using the light-emitting diode flip-chip grain. Background technique [0002] With the continuous development of the LED industry, flip-chip light-emitting diodes are gradually replacing conventional light-emitting diodes due to their advantages such as small package size and large light-emitting area, and are widely used in the LED lighting industry. [0003] Flip-chip LEDs have higher luminous power and generate more heat when emitting light. If the heat dissipation is not good, the wavelength of the light generated by the LEDs will shift, affecting the luminous effect of the LEDs. Contents of the invention [0004] In view of this, it is necessary to provide a light-emitting diode flip-chip chip with better heat dissipation effect to solve the above-mentioned problems. [0005] In addition, it is also necessary to provide a display using the above light-emitting diode f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/44H01L33/64H01L25/075
CPCH01L25/0753H01L33/44H01L33/641H01L2933/0025H01L2933/0075H01L33/20H01L33/382H01L33/08H01L33/387H01L33/62
Inventor 沈佳辉洪梓健彭建忠黄建翔黄世晟刘芝蓉
Owner ZHANJING TECH SHENZHEN
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