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Etching solution regeneration method

A technology for etching liquid and etching waste liquid, applied in the field of PCB board production, can solve the problems of complex regeneration method, adverse environmental impact, waste of etching liquid, etc., and achieve the effect of realizing reuse, reducing production cost and reducing waste.

Inactive Publication Date: 2018-02-16
深圳市新日东升电子材料有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the method of regeneration of etching solution is complicated and costly; and treating the etching solution as waste liquid directly wastes a large amount of etching solution, which also has adverse effects on the environment

Method used

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  • Etching solution regeneration method

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Embodiment Construction

[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0019] see figure 1 , the invention provides a kind of etchant regeneration method, comprises the steps:

[0020] S1. Provide etching waste liquid, which contains etching additives;

[0021] The waste etching solution may be a copper recycling solution obtained after decopper removal of the spent etching solution, or a spent etching solution.

[0022] S2. Analyze the consumption of each component of the etching additive in the etching waste liquid, define the additive component whose consumption is greater than the...

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Abstract

The invention provides an etching solution regeneration method which comprises the following steps that S1, etching waste solution is provided, and the etching waste solution contains etching additionagents; S2, the consumption quantities of all the components of the etching addition agents in the etching waste solution are analyzed, the addition agent component with the consumption quantity being larger than a consumption quantity threshold value is defined as the etching agent A, and the addition agent component with the consumption quantity being less than the consumption quantity threshold value is defined as the etching agent B; S3, the etching speed and etching factor of the etching waste solution being used in etching are measured; S4, the etching agent A and / or the etching agent Bare added to the etching waste solution according to the measured etching speed and etching factor. Compared with related technologies, according to the etching solution regeneration method providedby the invention, the etching agent A and / or the etching agent B are added to the etching waste solution according to the measured etching speed and etching factor, so that the reuse of the etching waste solution is realized, the waste of the etching solution is reduced, and the production cost and the environment pollution caused by the etching waste solution are lowered.

Description

technical field [0001] The invention relates to the field of PCB board production, in particular to a method for regenerating etching solution Background technique [0002] In the etching process of manufacturing printed circuit boards (PCBs), it is necessary to use a large amount of alkaline etching solution or acidic etching solution to process printed circuit boards, so that the etching process produces a large amount of alkaline etching waste liquid containing copper, ammonia, arsenic and other substances Or acid etching waste liquid. [0003] At present, the treatment methods of etching waste liquid are divided into two categories, one is to recover copper from the etching waste liquid and regenerate it, and the other is to extract the valuable metals in the etching liquid, do wastewater treatment, and discharge after reaching the standard. [0004] At present, the method of regeneration of etching solution is complex and costly; and treating the etching solution as wa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/46
CPCC23F1/46
Inventor 吴清清
Owner 深圳市新日东升电子材料有限公司