Unlock instant, AI-driven research and patent intelligence for your innovation.

High infrared transmittance structure

An infrared penetration and infrared technology, applied in coatings, optical filters, etc., can solve data leakage and other problems, achieve the effect of increasing sensitivity and detection distance, and improving penetration rate

Active Publication Date: 2020-12-08
INTERFACE TECH CHENGDU CO LTD +2
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, some electronic products can be unlocked through iris recognition and face recognition. In addition to using the singleness of biometrics, it is also necessary to be able to accurately judge the differences between different users, so as to avoid misjudgment and damage to electronic products. risk of data breach in

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High infrared transmittance structure
  • High infrared transmittance structure
  • High infrared transmittance structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] Several embodiments of the present invention will be disclosed in the following figures. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the present invention, these practical details are unnecessary. In addition, for the sake of simplifying the drawings, some well-known structures and components will be shown in a simple and schematic manner in the drawings.

[0035] Unless otherwise defined, all terms (including technical and scientific terms) used herein have their ordinary meanings that can be understood by those skilled in the art. Furthermore, the definitions of the above-mentioned words in the commonly used dictionaries should be interpreted in the content of this specification as meanings consistent with the relevant fields of the present invention. Unless specifically...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
refractive indexaaaaaaaaaa
Login to View More

Abstract

A high infrared transmittance structure has a substrate, an infrared ink layer and an anti-reflective layer. The infrared ink layer is formed on the substrate, and the anti-reflective layer is formed on the infrared ink layer to enhance the transmittance of the infrared rays.

Description

technical field [0001] The invention relates to a structure with high infrared transmittance, in particular to a structure for improving the infrared transmittance of electronic product detection equipment. Background technique [0002] With the rapid development of electronic products, the security and privacy protection of electronic products has become more important. At present, some electronic products can be unlocked through iris recognition and face recognition. In addition to using the singleness of biometrics, it is also necessary to be able to accurately judge the differences between different users, so as to avoid misjudgment and damage to electronic products. risk of data breaches. [0003] Relevant iris recognition and facial recognition technologies generally use infrared lenses to detect and identify the characteristics of the user's iris or face. If the characteristics of the authorized holder stored in the electronic product match, the electronic product wi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G02B5/20G02B1/11
CPCG02B1/11G02B5/20
Inventor 任陈铭黄彦衡姚彦章黎思奇
Owner INTERFACE TECH CHENGDU CO LTD