PCB board design method realizing uniform stacking processability and PCB board

Abstract

The invention proposes a design method realizing uniform stacking processability and a PCB board. The PCB board is arranged in a laminated structure with a number of layers. The copper thickness specification of a core board in the PCB board is set to be asymmetrical. According to the invention, a core board structure scheme with asymmetrical copper thickness specification is used; the quality ofa power supply network is ensured; the differential wiring width is increased by reducing the copper thickness; the processing difficulty of a board card is reduced; the improved scheme maintains thedevelopment cost of a traditional design method; the deficiency that improved board card development cost caused by the replacement of a Low DK board is compensated; and the competitiveness of a product in market is improved.

Description

technical field [0001] The invention relates to the field of PCB boards, in particular to a design method and a PCB board for achieving uniform stacking processability by changing the copper thickness combination mode of a core board. Background technique [0002] With the rapid development of electronic technology, the design of Server products tends to be high-density, high-speed, and differentiated. The increase in the high-speed IO functions and quantity of the product, and the reduction in the size of the structure make the layout design on the PCB board more difficult. [0003] In order to realize the feasibility of more high-speed IO interface routing under the condition of structural size limitation, to ensure the quality of high-speed signal transmission and the stability of system operation, in PCB design, usually by increasing the number of stacked layers, uniform Stacked design and other ways to achieve. Among them, the application of uniform lamination design,...

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Problems solved by technology

[0004] However, in the design of uniform stacking, from the consideration of design habit, the Core core board structure with the same copper thickness specification on both sides is adopted. When this kind of core board is applied, there are often some defects in the stacking design.

For example, when the thickness of the board is constant and the number of laminated layers is large, the thickness of the core board and PP in the uniform stacked structure is relatively thin. The width value will be thinner, such as 2.5mil line width. This line width value has exceeded the mass production capacity of the board factory, which will affect the feasibility of PCB board factory production and processing, resulting in increased difficulty in board production and processing, and increased scrap rate. risk

Therefore, in order to reduce the complexity of PCB processing and production, the usual practice is to use low dk value boards to reduce the parasitic capacitance between the transmission line and the reference layer, and increase the signal line width while meeting the impedance value requirements, but it increases the cost.

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