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Method and device conducive to force sensor resetting

A force sensor and sensing equipment technology, applied in the field of semiconductor packaging and testing, can solve the problems of false alarms, the placement head cannot apply the correct force, and the inability to stably approach a certain value, etc., to achieve the effect of improving stability

Active Publication Date: 2018-03-02
INTEL PROD CHENGDU CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the initial force sensed by the piezoelectric type force sensor is different after each reset and cannot be stably approached to a certain value
[0007] The unstable initial force sensed by the piezoelectric type force sensor will cause the placement head not to apply the correct force during the force control phase and cause many false alarms during the position control phase

Method used

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  • Method and device conducive to force sensor resetting
  • Method and device conducive to force sensor resetting
  • Method and device conducive to force sensor resetting

Examples

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Embodiment Construction

[0025] The subject matter described herein will now be discussed with reference to example implementations. It should be understood that the discussion of these implementations is only to enable those skilled in the art to better understand and realize the subject matter described herein, and is not intended to limit the protection scope, applicability or examples set forth in the claims. Changes may be made in the function and arrangement of elements discussed without departing from the scope of the disclosure. Various examples may omit, substitute, or add various procedures or components as needed. For example, the methods described may be performed in an order different from that described, and various steps may be added, omitted, or combined. Additionally, features described with respect to some examples may also be combined in other examples.

[0026] As used herein, the term "comprising" and its variants represent open terms meaning "including but not limited to". The...

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PUM

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Abstract

The invention relates to a method and a device conducive to force sensor resetting. The method includes the following steps: generating a plurality of candidate reset cycles and a plurality of candidate numbers of reset times of a force sensor, wherein the force sensor is a sensor which senses the value of a force applied thereto by converting the value of the force applied thereto into an electrical signal; and selecting a specific candidate reset cycle and a specific candidate number of reset times from the candidate reset cycles and the candidate reset numbers of times as the reset cycle and the number of reset times for resetting the force sensor, wherein among the candidate reset cycles and the candidate reset numbers of times, after the force sensor is reset according to the selectedcandidate reset cycle and the selected candidate number of reset times, the error of the value of force sensed by the force sensor is minimum when no force is applied. The method and the device can improve the stability of the force measured by the force sensor after reset.

Description

technical field [0001] The invention relates to the field of semiconductor packaging and testing, in particular to a method and device for resetting a force sensor during the packaging and testing process. Background technique [0002] In the flip chip packaging process, many operations require precise force to achieve good quality results, and force is also an important signal to reflect abnormalities in the process. [0003] Driven by increased input / output (I / O) density, pin pitch, substrate corelessness, and low dielectric constant (k) in flip-chip packaging, there is an emerging approach to Die-attach technology that realizes placement. Unlike traditional convective reflow placement techniques, in this new placement process, the placement head uses vacuum to pick up the chip and moves down to contact the substrate after the chip and substrate are aligned. After detecting that the chip touches the substrate, the placement head applies a certain force to compress the su...

Claims

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Application Information

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IPC IPC(8): G01L1/16G01L1/26G01L25/00
CPCG01L1/16G01L1/26G01L25/00
Inventor 罗德均
Owner INTEL PROD CHENGDU CO LTD