Cooling apparatus capable of preventing dust blockage

Abstract

The invention discloses a cooling device capable of preventing dust from clogging, which comprises a bottom plate and several cooling fins. The top of the bottom plate is provided with two side plates, the side plates are respectively located on both sides of the axis of the base, and the side plates can be placed on the base along the Moving in the horizontal direction, the side plates are provided with a number of grooves, the grooves are equipped with sliders matching the grooves, the sliders can move in the grooves, and there are some connections between the two side plates One end of the heat dissipation fin is connected with the slider, and the other end is inserted into the connection plate, and the heat dissipation fin can move along the horizontal direction in the connection plate, and a movable plate is arranged between the heat dissipation fins, and the movable plate Both sides are equipped with movable rods, which are horizontally inserted into the movable plate and can move horizontally in the movable plate. One end of the movable rod is inserted in the movable plate, and a bump is provided on the other end, and the movable rod can Rotate within the lug, which is connected to the side plate.

Description

technical field [0001] The invention relates to a radiator, in particular to a cooling device capable of preventing dust from clogging. Background technique [0002] Integrated circuits are heavily used in computer components. As we all know, high temperature is the enemy of integrated circuits. High temperature will not only lead to unstable operation of the system, shorten the service life, and may even burn some components. The heat that causes high temperature does not come from outside the computer, but from inside the computer, or inside the integrated circuit. The function of the radiator is to absorb the heat and then dissipate it inside or outside the case to ensure that the temperature of the computer components is normal. Most heat sinks absorb heat by contacting the surface of the heat-generating components, and then transfer the heat to a distant place through various methods, such as the air in the chassis, and then the chassis transfers the hot air to the o...

AI Technical Summary

Problems solved by technology

[0003] At present, most heat sinks are composed of a base and a number of heat dissipation fins. The heat sink fins are usually directly welded on the base. This method makes the contact area between the heat sink and the base smaller and increases the thermal resistance. , which is not conducive to better heat dissipation of electronic products. The heat dissipation fins are welded, so that when some of the heat dissipation fins are lost, it is not convenient for maintenance personnel to repair them. At the same time, the radiator is used for a long time. There will be a lot of dust attached between the cooling fins, which reduces the heat dissipation effect of the radiator

Images